International Electron Devices Meeting. Technical Digest
DOI: 10.1109/iedm.1996.553626
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Novel bulk dynamic threshold voltage MOSFET (B-DTMOS) with advanced isolation (SITOS) and gate to shallow-well contact (SSS-C) processes for ultra low power dual gate CMOS

Abstract: We have developed a high speed dynamic threshold voltage MOSFET named B-DTMOS for ultra low power operation. This was realized using a bulk wafer containing an individual trench isolatcd shallow-well with a high concentration buried layer sandwiched between two low concentration layers surrounded by a deep well. The B-DTMOS achieved an excellent propagation delay time of 83.6psec at 0.6V operation and 103.3psec at 0.5V operation. This was realized due to ultra low body rcsistance of the B-DTMOS .

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Cited by 26 publications
(7 citation statements)
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“…By introducing a narrow bandgap SiGe layer for the channel region, a reduction of can be achieved while keeping high impurity doping level at the body region. Such a highly doped body is effective for suppressing the short channel effect and reducing the body resistance that is a cause of propagation delay in the SOI DTMOS [3]. A higher drive current can be also expected utilizing the enhanced hole mobility in the SiGe channel.…”
Section: Sige Hdtmosmentioning
confidence: 96%
“…By introducing a narrow bandgap SiGe layer for the channel region, a reduction of can be achieved while keeping high impurity doping level at the body region. Such a highly doped body is effective for suppressing the short channel effect and reducing the body resistance that is a cause of propagation delay in the SOI DTMOS [3]. A higher drive current can be also expected utilizing the enhanced hole mobility in the SiGe channel.…”
Section: Sige Hdtmosmentioning
confidence: 96%
“…Isolation comes naturally for DTMOS when implemented on SOI wafers but is quite difficult for bulk silicon wafers. Reference [17] presented the first bulk DTMOS results using 1.5-m trenches and a four-well process-not a small task for most fabs. Other bulk-Si DTMOS options are currently being investigated.…”
Section: Process Issuesmentioning
confidence: 99%
“…The DTMOS scheme thus appears to be very promising for future low-power and high-speed circuit applications, since it improves the circuit speed without compromising the stand-by power. Previously reported DTMOS's, however, suffer from a small body-effect-factor ( ) [7]. This is because the normal suitable for low operation is usually too small to be compatible with a high substrate doping concentration, resulting in a low .…”
Section: Introductionmentioning
confidence: 99%
“…This is because the normal suitable for low operation is usually too small to be compatible with a high substrate doping concentration, resulting in a low . A low prevents the DTMOS from enjoying a large reduction in the on-state, thus minimizes its gain in on-state current-drive during DTMOS-mode operation [7]- [10]. Recently, we have proposed a new DTMOS using an SSR channel profile by indium implantation to overcome the above shortcomings [11].…”
Section: Introductionmentioning
confidence: 99%