2017
DOI: 10.1109/led.2016.2645451
|View full text |Cite
|
Sign up to set email alerts
|

Numerical Simulation for Operation of Flexible Thin-Film Transistors With Bending

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
9
0
1

Year Published

2017
2017
2020
2020

Publication Types

Select...
7

Relationship

1
6

Authors

Journals

citations
Cited by 15 publications
(10 citation statements)
references
References 15 publications
0
9
0
1
Order By: Relevance
“…Figure 3 shows the I ds ÀV ds characteristics of a flexible HEMT in the flat (black), bend-down (red), bend-up (blue), and re-flat (green) conditions with no applied gate voltage (V g ¼ 0 V). The bending direction is perpendicular to the source-to-drain direction to avoid decreased mobility resulting from the channel curvature, 19,20 as shown in the insets of Fig. 3.…”
mentioning
confidence: 99%
“…Figure 3 shows the I ds ÀV ds characteristics of a flexible HEMT in the flat (black), bend-down (red), bend-up (blue), and re-flat (green) conditions with no applied gate voltage (V g ¼ 0 V). The bending direction is perpendicular to the source-to-drain direction to avoid decreased mobility resulting from the channel curvature, 19,20 as shown in the insets of Fig. 3.…”
mentioning
confidence: 99%
“…(3) Field effect mobility μ n has been reported to be affected by strains for both bulk and flexible TFTs. 48 In this work, field effect mobility μ n can be calculated by eq 2, where C ox in eq 2 is expressed by…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…It shows that the field effect mobility μ n is the dominant factor for the performance variation of flexible TFTs with bending strains, The main reason is that, when the device is bent, electron velocity vector and electric field in device channel are not parallel, causing the decrease of μ n . 48 The decreased μ n leads to the reduction of channel conductivity, thus reducing both the drain current and peak transconductance with larger strain. Nevertheless, the flexible single-crystalline SiNM TFTs with BMN ceramic gate dielectrics show slight performance variations with bending strains, indicating a good robustness of these devices under mechanical deformation conditions.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…从柔性器件应用层面来讲, 现有的转移技术在薄 膜释放过程中都会带来一定程度的损耗, 有必要设计更新的转移工艺以减少损耗同时维持一个恰当的 成本 [108] . 虽然硅、锗薄膜纳米量级的厚度使其具备了机械上可弯曲的柔性, 但弯曲过程中伴随的应 力会对薄膜本身物理性质带来一定的影响, 甚至造成器件电学特性的衰退 [109,110] , 有必要在深入了解 其中的物理机制的基础上探索出更有效的解决措施. 此外, 现有的柔性薄膜器件多采用手工方式转移 及制备, 实现柔性硅锗器件大规模自动化生产流程, 将进一步促进这类材料在柔性器件上的应用.…”
Section: 总结与展望unclassified