2018
DOI: 10.1016/j.compstruct.2018.01.035
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On the fatigue response of a bonded repaired aerospace composite using thermography

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Cited by 27 publications
(14 citation statements)
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“…The temperature signal is often collected using a thermocouple. Since the fault can cause the temperature of machinery increase, recent research has shown the temperature signal carries rich diagnostic information for CM of rotating machinery [23,24,25]. The thermal camera, as an IRT image-measuring device, can measure the surface temperature of the object without contact.…”
Section: Introductionmentioning
confidence: 99%
“…The temperature signal is often collected using a thermocouple. Since the fault can cause the temperature of machinery increase, recent research has shown the temperature signal carries rich diagnostic information for CM of rotating machinery [23,24,25]. The thermal camera, as an IRT image-measuring device, can measure the surface temperature of the object without contact.…”
Section: Introductionmentioning
confidence: 99%
“…[14][15][16]18,19 Grammatikos et al further showed that LT can be used as a qualitative and quantitative approach to analyse the patch disbond process. 17,20 Literature shows that IrT methods are capable to inspect the different damage mechanisms in crack patched structures and that also both patch disbond and metallic cracks can be identified on thermal images. It further shows that disbond growths can be monitored.…”
Section: State Of the Art In Monitoring Crack Patchingmentioning
confidence: 99%
“…Other examples that show the ability of IrT methods to assess the repair integrity can be found 14–16,18,19 . Grammatikos et al further showed that LT can be used as a qualitative and quantitative approach to analyse the patch disbond process 17,20 …”
Section: Introductionmentioning
confidence: 99%
“…Among the most prevalent NDT techniques in the aeronautic field are ultrasonics, IR thermography, vibration methods, radiographic inspection, Eddy currents, electrical methods, etc. [5][6][7][8][9][10][11][12][13][14]. The majority of the techniques mentioned above require both the removal of the component to be tested and the utilisation of bulky and heavy sensors and equipment.…”
Section: Introductionmentioning
confidence: 99%