Thin films of the covellite phase of CuS are of special importance due to their properties for optoelectronic device applications. Their preparation by chemical solution methods could enable their deposition on flexible substrates at low temperature for large area applications. Successive Ionic Layer Adsorption and Reaction (SILAR) is a promising option because it is simple, inexpensive, and allows the control of thickness and composition. However, low crystalline CuS thin films have been reported so far. In this work, highly polycrystalline CuS thin films were successfully grown at room temperature by SILAR using CuSO4 and Na2S as the ionic solutions without post‐deposition annealing. The films obtained at different SILAR cycles resulted in good appearance, uniformity, well adhered to the substrate, and presented the covellite structure as the predominant crystalline phase. X‐ray diffraction analysis showed important details about the films growth evolution, which were in agreement with results from atomic force microscopy and ellipsometry. All the films exhibited low electrical resistivity in agreement with the metallic behavior observed in the infrared region of their transmittance spectra. These results demonstrate a direct method of obtaining highly polycrystalline CuS thin films at low temperature, which could open a new range of applications.