Optoelectronic multichip module integration for chip level optical interconnects

Prather, Dennis W.; Venkataraman, Sriram; LeCompte, Marion R.; Kiamilev, Fouad; Mait, Joseph N.; Simonis, George J.

doi:10.1109/68.950752

Cited by 13 publications

(3 citation statements)

References 7 publications

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“…Many different optical backplane constructions have been suggested and demonstrated, including glass fibers embedded in polymer sheets, polymer light guides [20], lens and mirror systems [21], [22], diffractive optical elements [23], and active pointing with microelectromechanical systems devices. These approaches have focused on demonstrating the viability of an optical platform and not on use in a computer system.…”

Section: Backplanesmentioning

confidence: 99%

Optical interconnects: out of the box forever?

Huang

Sze

Landin

et al. 2003

IEEE J. Select. Topics Quantum Electron.

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Based on a variety of optimization criteria, recent research has suggested that optical interconnects are a viable alternative to electrical interconnects for board-to-board, chip-to-chip, and on-chip applications. However, the design of modern high-performance computing systems must account for a variety of performance scaling factors that are not included in these analyses. We will give an overview of the performance scaling that has driven current computer design, with a focus on architectural design and the effects of these designs on interconnect implementation. We then discuss the potential of optics at each of these interconnect levels, in the context of extant electrical technology.

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Section: Backplanesmentioning

confidence: 99%

Optical interconnects: out of the box forever?

Huang

Sze

Landin

et al. 2003

IEEE J. Select. Topics Quantum Electron.

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“…One is Pb-free solders [1] and the other is electrically conductive adhesives (ECAs) [2]. Especially, along the advances of micro fabrication, the polymeric electronic packaging using resin materials include ECAs has been actively investigated as a key technology for future microelectromechanical systems (MEMS), micro-opto-electro-mechanical systems (MOEMS) [3], and optoelectronic multichip modules (OE-MCMs) [4] applications because of their potential advantages of low process temperature including low thermal stress during the process, fine pitch capability, and compatibility with non-solderable ones, etc. [5,6], besides the environmental issue.…”

Section: Introductionmentioning

confidence: 99%

“…Fig 4. Relation between initial misalignment level and self-alignment accuracy according to the viscosity level and the liquid volume.…”

mentioning

confidence: 99%

Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability

Kim

Shin

Fujimoto

2003

MSF

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We developed highly precise self-alignment process using resin materials for next generation microelectromechanical systems (MEMS), micro-opto-electro-mechanical systems (MOEMS) and optoelectronic multichip modules (OE-MCMs) applications. Although liquid resins have a characteristic as low as one tenth of the surface tension of solder in general, self-alignment capability could be achieved by using 3-D pads for positioning boundary. In this research, we propose the novel passive alignment mechanism in order to enhance understanding of alignment motion. Moreover, the influence of viscosity on alignment motion and alignment accuracy is demonstrated by scaled-up experiment. We could achieve highly precise alignment accuracy less than 0.4 mm.

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