Organic Airborne Molecular Contamination in Semiconductor Fabrication Clean Rooms

Abstract

Monitoring of airborne molecular contamination ͑AMC͒ has become a crucial element of cleanroom management as the production phase of semiconductor devices marches deep into sub-100-nm range. The current understandings of the AMC, particularly those with organic origins, are presented comprehensively in this article based on the research reports within the past ten years. Starting with a review of the chronological development of AMC problems and several approaches for the AMC classifications, this article also examines the merits of several available ambient sampling and surface analytical methods. The focal point of the article is to address the surface deposition potential of organic AMCs by experimentally correlating the surface speciation and abundance of the organic AMCs with their physical and chemical characteristics, together with the kinetic models delineating the rates of deposition for both single-and multiple-contaminant scenarios. In addition, the current progress of the AMC control strategies, especially the development of the chemical filtration technology, is also examined in the paper.

Tomographic PIV measurement of internal complex flow of an evaporating droplet with non-uniformly receding contact lines

“…(9)(10)(11)(12) Additionally, we can also suspect that the SAM substrate in air may result in a random adsorption of Airborne Molecular Contamination (AMC). (27) During the experiment, the substrate is exposed to air. Then, the substrate condition can be locally changed.…”

Influence of Fluoride Ions Contamination in Front Opening Unified Pod (FOUP) Generating Defective Bonding Pad

“…As well known, many kinds of chemicals are used and various kinds of particles form in the semiconductor manufacturing process and airborne molecular contaminations (AMCs) from these chemicals. Particles with moisture in the air not only contaminate wafer itself but also have effect on wire bonding which can generate product defects (Kikyuama et al, 1991;Den et al, 2006;Lin et al, 2010;Lee et al, 2015). To prevent this kind of contamination by exposure to the air, wafers on which chip is formed are stored or moved in the enclosed carrier called front opening unified pod (FOUP) and particles or AMCs remaining on wafers may diffuse into FOUP and contaminate it (Frickinger et al, 2000;Hu et al, 2005;Hu et al, 2009).…”

Validation of Direct Analysis Real Time source/Time-of-Flight Mass Spectrometry for organophosphate quantitation on wafer surface

“…AMC includes all gaseous or vapor state contaminants emitted by fugitive sources or during the wafer fabrication process [1]. A classification of these AMCs was presented in the SEMI Standard F21-1102 (Semiconductor Equipment and Materials International).…”

“…Phthalate esters, such as DEP (Diethyl phthalate) are present in the clean rooms as condensable emerging from the polymers used in these rooms where they are employed as plasticizers. Among the dopants, organophosphate, such as TCEP (Tris-(2-chloroethyl) phosphate) and TCPP (Tris-(2-chloroisopropyl) phosphate) are frequently observed in clean rooms stemming from the large abundance of plastic polymers in which they are used as flame retardant [1]. These additives are not chemically bound to the polymer, which implies they can migrate from the plastic polymer to the environment and contaminate the surrounding of the polymer [3,4,5].…”