Overview of residual stress in MEMS structures: Its origin, measurement, and control

Dutta, Shankar; Pandey, Akhilesh

doi:10.1007/s10854-021-05405-8

Cited by 33 publications

(12 citation statements)

References 148 publications

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“…Integration of these metal nanoparticles in printable inks allows their incorporation in MEMS devices [22,[25][26][27]. Ligand-protected metal nanoparticles have shown extremely high ink stability.…”

Section: Liga Process Overviewmentioning

confidence: 99%

Digital LIGA: exploitation of droplet-on-demand inkjet printing to fabricate complex mechanical structures by electroforming

Sels¹,

Blum

Chandran

et al. 2023

J. Micromech. Microeng.

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A novel 3D fabrication technique called digital LIGA is proposed, integrating functional digital printing with 3D microfabrication via electrodeposition. This allows for the realization of complex multilevel metallic structures without problems associated with merging growth fronts. To achieve this, we developed a gold nanoparticle ink, compatible with a SU-8 photoresist, for printing the digitally-defined seed layers. Using this ink, selective printing of a conductive seed layer on a multi-level photoresist was used along with subsequent electrodeposition. Defect-free complex multilevel metallic 3D structures were successfully prepared via this method.

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Section: Liga Process Overviewmentioning

confidence: 99%

Digital LIGA: exploitation of droplet-on-demand inkjet printing to fabricate complex mechanical structures by electroforming

Sels¹,

Blum

Chandran

et al. 2023

J. Micromech. Microeng.

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“…Residual stresses are known to be of significant importance for MEMS structures and have multiple points of origin, including defects present within the film. [57][58][59] Various studies in the literature have previously reported on the residual stress of silicon nitride. [60][61][62] In the current design, it is desirable to achieve silicon nitride films with a slight tensile stress, as this results in flat MEMS structures which in our case while unactuated state were characterized to remain flat within 10 nm over the distance of 152 nm between the anchors.…”

Section: Sin X Photonic Switchmentioning

confidence: 99%

Broadband Microelectromechanical Systems‐Based Silicon Nitride Photonic Switch

Swain,

Zawierta,

Gurusamy

et al. 2023

Advanced Photonics Research

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Over the past three decades, silicon photonic devices have been core to the realization of large‐scale photonic‐integrated circuits. However, silicon nitride is another key complementary metal oxide semiconductor‐compatible material for high‐density photonic‐integrated circuits, having low manufacturing costs, low optical losses, and excellent mechanical properties, that can provide enhanced performance over silicon in an integrated photonic platform. This article presents the design, fabrication, and testing of a proof‐of‐concept switchable silicon nitride photonic coupler that leverages these properties combined with microelectromechanical systems actuation. The photonic platform uses a moveable suspended waveguide to enable efficient out‐of‐plane switching and is built using conventional lithographic techniques to demonstrate the high compatibility with existing microelectronic fabrication techniques. The photonic switch is measured to have an insertion loss of 2.6 dB and an ON/OFF extinction ratio of 34 dB at the output of the suspended waveguide, at a wavelength of 1470 nm. Detailed simulations demonstrate broadband operation over a 600 nm wavelength range from 1.25 to 1.85 μm which is experimentally validated over the range from 1.25 to 1.61 μm. To the best of knowledge, this is the broadest operation range ever demonstrated by a photonic switch in simulation.

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“…Accelerometers, relays, and gyroscopes are usually processed by SOG (silicon on glass) technology, which is relatively simple and has a very low parasitic capacitance [32][33][34]. The structure was manufactured with SOG.…”

Section: Fabricationmentioning

confidence: 99%

Design and Fabrication of a Novel Wheel-Ring Triaxial Gyroscope

Guo

Wei

Cai

et al. 2022

Sensors

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This paper presents a new type of three-axis gyroscope. The gyroscope comprises two independent parts, which are nested to further reduce the structure volume. The capacitive drive was adopted. The motion equation, capacitance design, and spring design of a three-axis gyroscope were introduced, and the corresponding formulas were derived. Furthermore, the X/Y driving frequency of the gyroscope was 5954.8 Hz, the Y-axis detection frequency was 5774.5 Hz, and the X-axis detection frequency was 6030.5 Hz, as determined by the finite element simulation method. The Z-axis driving frequency was 10,728 Hz, and the Z-axis sensing frequency was 10,725 Hz. The MEMS gyroscope’s Z-axis driving mode and the sensing mode’s frequency were slightly mismatched, so the gyroscope demonstrated a larger bandwidth and higher Z-axis mechanical sensitivity. In addition, the structure also has good Z-axis impact resistance. The transient impact simulation of the gyroscope structure showed that the maximum stress of the sensitive structure under the impact of 10,000 g@5 ms was 300.18 Mpa. The gyroscope was produced by etching silicon wafers in DRIE mode to obtain a high aspect ratio structure, tightly connected to the glass substrate by silicon/glass anode bonding technology.

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Overview of residual stress in MEMS structures: Its origin, measurement, and control

Cited by 33 publications

References 148 publications

Digital LIGA: exploitation of droplet-on-demand inkjet printing to fabricate complex mechanical structures by electroforming

Digital LIGA: exploitation of droplet-on-demand inkjet printing to fabricate complex mechanical structures by electroforming

Broadband Microelectromechanical Systems‐Based Silicon Nitride Photonic Switch

Design and Fabrication of a Novel Wheel-Ring Triaxial Gyroscope

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