Pb-free solder-alloy based on Sn–Zn–Bi with the addition of germanium

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

“…1 Furthermore, driven by government legislation, the electronics industry has advanced to lead-free solders due to environmental and health concerns emanating from the use of Pb-based solders. [2][3][4][5] To date, several types of lead-free solders have been developed such as Sn-Ag, Sn-Cu, Sn-Bi and Sn-AgCu alloys. 6,7 Sn-Ag-Cu (SAC) alloy has good mechanical properties and wettability, making it the most widely used lead-free solder.…”

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

“…This has prompted a search for "lead-free" solders and more attention in the research activities in this field. Up to now, several types of binary and ternary Sn-based lead-free solders such as Sn-Ag, Sn-Cu, Sn-Au, Sn-Ag-Cu and Sn-Zn have been developed and applied in the electronic packaging industry [4][5][6]. Among the various types of lead-free solders, with a combination of process attributes like a modest melting temperature and reasonable solderability, comparable electrical performance and good mechanical properties, Sn-Ag-Cu solder has been proposed as one of the most promising substitutes for conventional Sn-Pb solder [7,8].…”

Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

“…Owing to the realization of the inherent toxicity of lead (Pb) and leadcontaining alloys on the environment and human health, increasing efforts have been made to search for suitable lead-free solders as replacement for the conventional Sn-Pb eutectic alloy [1][2][3][4]. Thus, many research groups are concerned with the development of new lead-free solders and their composites.…”