Peak crosstalk noise estimation in CMOS VLSI circuits

Tang, K.T.; Friedman, Eby G.

doi:10.1109/icecs.1999.814464

Cited by 21 publications

(10 citation statements)

References 8 publications

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“…Coupling noise (or crosstalk) between adjacent interconnects is a matter of primary concern for present and future generations of CMOS VLSI circuits. As the feature size decreases to deep sub micrometer dimensions, the coupling effects become more significant . In this Section, a comparative study of crosstalk analysis between (i) SWCNT bundle interconnects with coupling capacitance estimated (a) conventionally (conventional model) and (b) as proposed earlier, in the present study (proposed model) and (ii) copper interconnects, is reported.…”

Section: Crosstalk Analysismentioning

confidence: 88%

Temperature dependant crosstalk analysis in coupled single‐walled carbon nanotube (SWCNT) bundle interconnects

Kumar

Sarkar

2014

Circuit Theory & Apps

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The temperature‐dependent, crosstalk‐induced, noise voltage waveform and its frequency spectrum, in capacitive coupled single‐walled carbon nanotube (SWCNT) bundle interconnects, at the far end of victim line, have been analyzed at 22‐nm technology node. A similar analysis is performed for copper interconnects and a comparison is made between the results of these two analyses. The SPICE simulation results reveal that at temperature variations ranging from 300 to 500 K, compared with conventional metal (copper) conductors, crosstalk noise voltage levels in CNT, at the far end of victim line, are significantly low. Simulated results further reveal that, with rise in interconnect temperatures, compared with copper interconnects, coupled interconnects of SWCNT bundle filter more noise frequency components. Based on these comparative results, an improved model for extracting inter‐bundle, real life, coupling capacitances between SWCNT bundles has been proposed. Copyright © 2014 John Wiley & Sons, Ltd.

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Section: Crosstalk Analysismentioning

confidence: 88%

Temperature dependant crosstalk analysis in coupled single‐walled carbon nanotube (SWCNT) bundle interconnects

Kumar

Sarkar

2014

Circuit Theory & Apps

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“…. The noise produced by shielded and unshielded interconnects can be obtained from the peak noise model (24) and the peak noise models described in [2] and [3], respectively. The reduction in noise achieved by increasing the physical separation and by inserting a shield are compared in Fig.…”

Section: B Increasing the Separation Vs Inserting A Shieldmentioning

confidence: 99%

“…When noise occurs simultaneously with a switching event, the effect of noise is manifested as a change in the timing of the signal transition [1]. Several design and analysis techniques [2], [3] have been developed to manage delay uncertainty while minimizing signal noise.…”

Section: Introductionmentioning

confidence: 99%

Effect of shield insertion on reducing crosstalk noise between coupled interconnects

Zhang

Friedman

2004 IEEE International Symposium on Circuits and Systems (IEEE Cat. No.04CH37512)

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Abstract-Placing shields around a victim signal line is a common way to enhance signal integrity while minimizing delay uncertainty. For two coupled interconnects with a shield between the lines, the coupling noise can produce a peak noise of 15% ofmodel is used to develop an analytic estimate of the peak noise for shielded interconnects. The peak noise model is accurate within an average error of 4.4% as compared to SPICE. The effects of the shield width, length, separation between the shield and the signal, and the number of connections tieing the shield to ground on the overall crosstalk noise are described in this paper. Based on the peak noise model, a minimum number of ground connections for a target shield line with noise constraints is obtained. Inserting a shield line between two coupled interconnects is shown to be more effective in reducing crosstalk noise than increasing the physical separation.

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“…Ref. [7] gives closed form equations for the approximate coupling noise in the time domain, for coupled lines where the resistance is small compared to the inductive impedance.…”

Section: Introductionmentioning

confidence: 99%

Repeater insertion to minimise delay in coupled interconnects

Pamunuwa

Tenhunen²

VLSI Design 2001. Fourteenth International Conference on VLSI Design

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Signalling over long interconnect is a dominant issue in electronic chip design in current technologies, with the device sizes getting smaller and smaller and the circuits becoming ever larger. Repeater insertion is a well established technique to minimise the propagation delay over long resistive interconnect. In deep sub-micron technologies, as the wires are spaced closer and closer together and signal rise and fall times go into the sub-nano second region, the coupling between interconnects assumes great significance. The resulting cross talk has implications on the data throughput and on signal integrity. Depending on the data correlation on the coupled lines, the delay can either decrease or increase. In this paper we attempt to quantify the effect of worst-case capacitive cross talk in parallel buses and look at how it affects repeater insertion in particular. We develop analytic expressions for the delay, buffer size and number that are suitable in a-priori timing analyses and signal integrity estimations. All equations are checked against a dynamic circuit simulator (SPECTRE).

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Peak crosstalk noise estimation in CMOS VLSI circuits

Cited by 21 publications

References 8 publications

Temperature dependant crosstalk analysis in coupled single‐walled carbon nanotube (SWCNT) bundle interconnects

Temperature dependant crosstalk analysis in coupled single‐walled carbon nanotube (SWCNT) bundle interconnects

Effect of shield insertion on reducing crosstalk noise between coupled interconnects

Repeater insertion to minimise delay in coupled interconnects

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