2010
DOI: 10.1063/1.3282706
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Piezoelectric Pb(Zr0.52Ti0.48)O3 thin films on single crystal diamond: Structural, electrical, dielectric, and field-effect-transistor properties

Abstract: The combination of piezoelectric materials and single crystal diamond offers the opportunity for the development of multifunctional micromachined devices under extreme conditions. In this work, the authors report the structural, electrical, optical, and dielectric properties of Pb͑Zr 0.52 ,Ti 0.48 ͒O 3 ͑PZT͒ thin films integrated on single crystal diamond ͑100͒ substrates. The corresponding field effect transistor based on the metal-piezoelectric-insulator-semiconductor ͑MPIS͒ structure was fabricated on a hom… Show more

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Cited by 11 publications
(4 citation statements)
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“…Higher sweep voltage results in enhanced memory window due to higher electric field stored in the PZT film. 9 Further, we obtained continuous enhancement in the memory window with annealing temperature in the temperature range of 400-600 C for both the buffer layers. It appears that the ferroelectricity of the film is improved which increases the volume fraction of the ferroelectric tetragonal phase.…”
mentioning
confidence: 72%
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“…Higher sweep voltage results in enhanced memory window due to higher electric field stored in the PZT film. 9 Further, we obtained continuous enhancement in the memory window with annealing temperature in the temperature range of 400-600 C for both the buffer layers. It appears that the ferroelectricity of the film is improved which increases the volume fraction of the ferroelectric tetragonal phase.…”
mentioning
confidence: 72%
“…Thin films of Ti rich PZT also known as PZT(35/65) having the ability to store large amount of charges in small region in lower coercive field show higher remnant polarization, which makes it an attractive material for the gate in FeFET. [6][7][8][9][10][11] However, it is difficult to get the good interface between the PZT and the Si substrate due to the fact that most ferroelectric materials easily react with Si to form a non-ferroelectric interfacial layer even at low annealing temperature (<500 C) thus degrading the device integrity. 12 Further, the diffusion of Pb from the PZT to the channel layer of FeFET is of great concern in VLSI devices.…”
mentioning
confidence: 99%
“…Oxide perovskite materials, such as AMnO 3 , [11,67] ATiO 3 , [6,12,14,[68][69][70][71][72][73][74] A 2 CuO 4 , [75] ATaO 3 , [76,77] and ASnO 3 , [15] can be used as active layers in FETs. The electron mobility values measured in a FET device for oxide perovskite materials are summarized in Figure 2a.…”
Section: Oxide Perovskite As N-and P-type Channelsmentioning
confidence: 99%
“…ATiO 3 compounds, such as STO, [6,14,[68][69][70][71][72]74] La-doped STO, [12] and Pb(Zr 0.52 Ti 0.48 )O 3 (0.52-doped PZT), [73] can be applied as semiconductors in FETs. STO is also a typical model system for the investigation of the electronic structure of transition metal oxides with perovskites crystal structures.…”
Section: Oxide Perovskite As N-and P-type Channelsmentioning
confidence: 99%