This paper presents for the first time the effect of strain on the electrical conductance of p-type nanocrystalline SiC grown on a Si substrate. The gauge factor of the p-type nanocrystalline SiC was found to be 14.5 which is one order of magnitude larger than that in most metals. This result indicates that mechanical strain has a significant influence on electrical conduction of p-type nanocrystalline SiC, which is promising for mechanical sensing applications in harsh environments.Silicon carbide (SiC) with its large energy band gap (2.3-3.4 eV) and excellent mechanical properties is a promising material for electrical devices operating in harsh environments 1-3 . Recently, researchers have paid significant attention to the characterization of the strain effect on SiC for sensing applications at high temperatures. Many groups have reported the piezoresistive effect in various poly types of single crystalline SiC such as 3C-SiC, 4H-SiC, and 6H-SiC. Large gauge factors of approximately 30 were reported in both p-type and n-type single crystalline SiC, indicating that SiC is a good candidate for mechanical sensing applications 4-11 . Among more than 200 poly types of crystalline SiC, cubic crystalline silicon carbide (3C-SiC) is preferable for Micro Electro Mechanical Systems (MEMS) transducers. The main advantage of 3C-SiC is the capability of growth on a silicon (Si) substrate, which reduces the cost of wafers and is more compatible with the conventional MEMS process 3,9-12 . Nevertheless, Si is not a suitable material for hostile environment applications due to the current leakage from the epitaxy SiC layer to the Si substrate at high temperatures. Therefore, wafer bonding techniques are required to transfer single 3C-SiC to other electrical insulating substrates, which can withstand high temperatures (e.g silicon dioxide and silicon nitride) 13 . This process indeed increases the cost of wafers as well as complicates the fabrication of SiC devices.Different from single crystalline SiC, nanocrystalline SiC (nc-SiC), with its grain size in sub-micron scale, can be grown on various substrates (e.g. silicon, silicon dioxide, silicon nitride) and therefore, it is a good candidate for MEMS trans- *