Solid State Circuits Technologies 2010
DOI: 10.5772/6886
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Polycrystalline Silicon Piezoresistive Nano Thin Film Technology

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Cited by 6 publications
(4 citation statements)
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“…[21] However, similar trends in G have been reported in mixed CNT [56,57] and graphene composites, [19] as well as layered CNT [58] and patterned polysilicon composites. [59] This increase in sensitivity with Mf (i.e.…”
Section: Mechanical Characterisation and Electromechanical Responsementioning
confidence: 95%
“…[21] However, similar trends in G have been reported in mixed CNT [56,57] and graphene composites, [19] as well as layered CNT [58] and patterned polysilicon composites. [59] This increase in sensitivity with Mf (i.e.…”
Section: Mechanical Characterisation and Electromechanical Responsementioning
confidence: 95%
“…The decrease of the piezoresistance in poly SiC compared to crystalline SiC can be explained by using the model of polycrystalline semiconductors. Accordingly, the diminution of gauge factor could be reasoned by the random alignment of crystal grain inside the poly materials [94], or due to the scattering of carriers at grain boundaries [95], [96].…”
Section: B Piezoresistive Effect In Silicon Carbidementioning
confidence: 99%
“…These defects result in the formation of trapping states which immobilize charge carriers, creating a potential barrier (V b ) 32,33 . Consequentially, the carriers can move through these potential barriers via the tunneling current which is described in the following equation 36,37 :…”
mentioning
confidence: 99%
“…These defects result in the formation of trapping states which immobilize charge carriers, creating a potential barrier (V b ). 32,33 Consequentially, the carriers can move through these potential barriers via the tunneling current which is described in the following equation: 36,37 J f p hh J hh + p lh J lh (6) where p hh and p lh are the concentrations of heavy hole and light hole; and J hh and J lh are tunneling current components of heavy hole and light hole which depend on the potential barrier (f e qV b /kT , where q is the electron charge; V b is the potential barrier; k is the Boltzmann constant; and T is the absolute temperature). Under strain, heavy hole and light hole concentrations change.…”
mentioning
confidence: 99%