Polyimide in Electronics: Applications and Processability Overview

Diaham, Sombel

doi:10.5772/intechopen.92629

Cited by 27 publications

(15 citation statements)

References 21 publications

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“…Although the Kapton ® substrate is rated to handle 350 • C and up to 400 • C for intermittent exposure [69], the performance of the printed SiC thermistor is restricted to 170 • C due to the Nextron micro-probe stations' maximum temperature limit. The thermistors of each ink formulation were thermally cycled between 25 • C and 170 • C five times, and the electrical resistance was recorded.…”

Section: Printed Sic Thermistor Characterizationmentioning

confidence: 99%

All Screen Printed and Flexible Silicon Carbide NTC Thermistors for Temperature Sensing Applications

Wadhwa,

Benavides-Guerrero,

Gratuze

et al. 2024

Materials

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In this study, Silicon Carbide (SiC) nanoparticle-based serigraphic printing inks were formulated to fabricate highly sensitive and wide temperature range printed thermistors. Inter-digitated electrodes (IDEs) were screen printed onto Kapton® substrate using commercially avaiable silver ink. Thermistor inks with different weight ratios of SiC nanoparticles were printed atop the IDE structures to form fully printed thermistors. The thermistors were tested over a wide temperature range form 25 °C to 170 °C, exhibiting excellent repeatability and stability over 15 h of continuous operation. Optimal device performance was achieved with 30 wt.% SiC-polyimide ink. We report highly sensitive devices with a TCR of −0.556%/°C, a thermal coefficient of 502 K (β-index) and an activation energy of 0.08 eV. Further, the thermistor demonstrates an accuracy of ±1.35 °C, which is well within the range offered by commercially available high sensitivity thermistors. SiC thermistors exhibit a small 6.5% drift due to changes in relative humidity between 10 and 90%RH and a 4.2% drift in baseline resistance after 100 cycles of aggressive bend testing at a 40° angle. The use of commercially available low-cost materials, simplicity of design and fabrication techniques coupled with the chemical inertness of the Kapton® substrate and SiC nanoparticles paves the way to use all-printed SiC thermistors towards a wide range of applications where temperature monitoring is vital for optimal system performance.

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Section: Printed Sic Thermistor Characterizationmentioning

confidence: 99%

All Screen Printed and Flexible Silicon Carbide NTC Thermistors for Temperature Sensing Applications

Wadhwa,

Benavides-Guerrero,

Gratuze

et al. 2024

Materials

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“…Molecular structure of major diamine and dianhydride monomers for commercial synthesis of polyimides. [84] Diamines degradation, and recycling. The main forms of damage to PI materials in the application were discussed in the previous section.…”

Section: Theory and Damage Evaluation Of Dynamic Polyimidesmentioning

confidence: 99%

Rising of Dynamic Polyimide Materials: A Versatile Dielectric for Electrical and Electronic Applications

et al. 2023

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Polyimides (PIs) are widely used in circuit components, electrical insulators, and power systems in modern electronic devices and large electrical appliances. Electrical/mechanical damage of materials are important factors that threaten reliability and service lifetime. Dynamic (self‐healable, recyclable and degradable) PIs, a promising class of materials that successfully improve electrical/mechanical properties after damage, are anticipated to solve this issue. The viewpoints and perspectives on the status and future trends of dynamic PI based on a few existing documents are shared. The main damage forms of PI dielectric materials in the application process are first introduced, and initial strategies and schemes to solve these problems are proposed. Fundamentally, the bottleneck issues faced by the development of dynamic PIs are indicated, and the relationship between various damage forms and the universality of the method is evaluated. The potential mechanism of the dynamic PI to deal with electrical damage is highlighted and several feasible prospective schemes to address electrical damage are discussed. This study is concluded by presenting a short outlook and future improvements to systems, challenges, and solutions of dynamic PI in electrical insulation. The summary of theory and practice should encourage policy development favoring energy conservation and environmental protection and promoting sustainability.

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“…Polyimide is an industrially important polymer used as insulating material in various applications such as electrical mo- tor windings, aeronautics and aerospace, power electronics and microelectronics. [11] For instance, it can be found as a coating film or tape for power device passivation, [12] wafer-level packaging [13] isolation barrier for digital isolators, [14] or in transmission cables. [15] Over the last decades, the dielectric breakdown strength of PI films, mostly reported on Kapton tapes or on spincoated films, have been widely investigated under AC, [9,10,[16][17][18][19][20][21][22] DC [16,17,[23][24][25][26] or impulse [18] voltages.…”

Section: State-of-the-art Of Polyimide Breakdown Field Versus Thickne...mentioning

confidence: 99%

Intrinsic AC Dielectric Breakdown Strength of Polyimide Films at the Extreme: New Breakthrough Insights on Thickness Dependence

Diaham,

Lambkin,

O'Sullivan

et al. 2023

Adv Materials Inter

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To date, the AC dielectric breakdown strength of polyimide (PI) films, as for most polymers, is understood to follow a thickness dependency with a measured power law exponent, n ≈ 0.5. However, this work experimentally demonstrates that the AC dielectric strength of PI films is quasi‐thickness independent. Evidence is presented showing that the thickness dependency described in the literature can be explained by an extrinsic failure mode, driven by partial discharges occurring at the dielectric‐oil‐electrode triple point. Triple points can be avoided by electrode encapsulation, which subsequently recovers a purely intrinsic failure mode for PI films over a large thickness range. Consequently, the AC dielectric strength of thick PI films is intrinsic and quasi‐thickness independent, at least for film thickness up to 60 µm. For the first time, a “theoretical” AC breakdown field for PI films is reported as ≈520 Vrms µm−1. Finally, the highest experimental breakdown field values are obtained here with 505 Vrms µm−1 and 705 Vµm−1 under AC and DC fields, respectively.

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Polyimide in Electronics: Applications and Processability Overview

Cited by 27 publications

References 21 publications

All Screen Printed and Flexible Silicon Carbide NTC Thermistors for Temperature Sensing Applications

All Screen Printed and Flexible Silicon Carbide NTC Thermistors for Temperature Sensing Applications

Rising of Dynamic Polyimide Materials: A Versatile Dielectric for Electrical and Electronic Applications

Intrinsic AC Dielectric Breakdown Strength of Polyimide Films at the Extreme: New Breakthrough Insights on Thickness Dependence

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