High-speed operation and low-power-consumption requirements have accelerated the development of thin-film transistors (TFTs) with exploration of gate dielectrics. In this work, the integration of all-sputtering-derived HfGdO high-k gate dielectrics with amorphous InGaZnO (a-InGaZnO) films has been reported, yielding significant improvements in the performance of a-InGaZnO TFTs. By adjusting the multilayer dielectric sequence, TFT device performance can be precisely manipulated. It has been detected that a-InGaZnO TFTs with an optimized Al 2 O 3 /HfGdO dielectric configuration have demonstrated superior electrical performance, including a high field-effect mobility (μ FE ) of 23.3 cm 2 • V −1 •S −1 , a large on/off current ratio of 1.2 × 10 7 , a low subthreshold swing of 0.09 V/dec, and good stability under bias stress. Finally, a low-voltage-operated resistor-loaded unipolar inverter has been assembled on the base of Al 2 O 3 /HfGdO/a-InGaZnO TFTs, demonstrating full swing characteristics and high gain of ∼20. All of the experimental results indicate promising potentials for all-sputtering-derived Al 2 O 3 /HfGdO laminated dielectrics toward the achievement of low-cost, low-power-consumption, and largearea all-oxide optoelectronics.