Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss

Abstract

We propose a multilayered-substrate-based power semiconductor discrete device package for a low switching loss and high heat dissipation. To verify the proposed package, cost-effective, low-temperature cofired ceramic, multilayered substrates are used. A bare die is attached to an embedded cavity of the multilayered substrate. Because the height of the pad on the top plane of the die and the signal line on the substrate are the same, the length of the bond wires can be shortened. A large number of thermal vias with a high thermal conductivity are embedded in the multilayered substrate to increase the heat dissipation rate of the package. The packaged silicon carbide Schottky barrier diode satisfies the reliability testing of a high-temperature storage life and temperature humidity bias. At 175°C, the forward current is 7 A at a forward voltage of 1.13 V, and the reverse leakage current is below 100 lA up to a reverse voltage of 980 V. The measured maximum reverse current (I RM ), reverse recovery time (T rr ), and reverse recovery charge (Q rr ) are 2.4 A, 16.6 ns, and 19.92 nC, respectively, at a reverse voltage of 300 V and di/dt equal to 300 A/ls.

Towards an LTCC SiP for Control System in Safety-Critical Applications

“…Thin dielectrics also reduce the inductive behavior of the traces. Furthermore, parasitic inductance degrades the performance of the power stage [9]. Thick-film boards are used for their printed electronics, high integration density and thin dielectric thickness [23,24].…”

“…Some in particular (e.g. [6][7][8][9][10][11][12][13]) implement the power stage with specific 3D power packages, but do not integrate mixed analog and digital circuits, as required for closed-loop readback mechanisms in this work.…”

“…In terms of thermal management and efficiency, LTCC is used for its superior thermal properties for power converters in conjunction with cavities to reduce interconnect parasitics and improve efficiency [9,10]. However, LTCC silver pastes have inferior electrical and thermal conductivity to copper and limited conductor thickness [16].…”

Power module stray inductance extraction: Theoretical and experimental analysis

“…The stray inductance of a power module results in semiconductor breakdown caused by the overshoot voltage on turn-off transitions, which greatly affects both the system's safety and reliability and its efficiency due to the increase in switching energy loss [1][2][3][4][5][6]. A voltage drop causes the overvoltage that occurs when the module switch turns off via the diode, the bond wires that make up the module, the metal patterns on the double-bonded copper solders for the chip, and the terminal bonding.…”

Efficiency improvement of a DC/DC converter using LTCC substrate

“…Our group has studied discrete power device packages with an embedded cavity in multilayer LTCC to reduce the parasitic inductance caused by wire bonding . Virginia's Polytechnic Institute and State University has studied planar inductors using magnetic tape and a multilayer LTCC manufacturing process to implement small‐size non‐isolated point‐of‐load (POL) converters .…”