2001
DOI: 10.1147/rd.455.0697
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Printing meets lithography: Soft approaches to high-resolution patterning

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Cited by 463 publications
(353 citation statements)
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“…We attribute the postimprint feature relaxation to surface diffusion, driven by a reduction in surface energy; surface diffusion is pronounced in such smallmolecular-weight organic compounds. 8,9 The improvement in feature stability between 80Ϫ90°C is related to a change in the crystallinity as demonstrated by X-ray diffraction (XRD) data ( Figure 5). XRD spectra of SubPc-A samples imprinted at various temperatures were measured and are plotted in Figure 5a.…”
Section: Resultsmentioning
confidence: 98%
“…We attribute the postimprint feature relaxation to surface diffusion, driven by a reduction in surface energy; surface diffusion is pronounced in such smallmolecular-weight organic compounds. 8,9 The improvement in feature stability between 80Ϫ90°C is related to a change in the crystallinity as demonstrated by X-ray diffraction (XRD) data ( Figure 5). XRD spectra of SubPc-A samples imprinted at various temperatures were measured and are plotted in Figure 5a.…”
Section: Resultsmentioning
confidence: 98%
“…SEM images of the resulting surfaces demonstrate the accuracy and precision of the transfer of small densely populated structures, as well as large deprotected areas and micrometer size features, a task that remains one of the most challenging for traditional µCP ( Figure 5). 6 The transferred pattern contains 3000 × 600 nm rods separated by 2000 nm and were produced from stamp structures with 0.042 aspect ratio; these features were accurately and uniformly reproduced over the entire stamped region, indicating the absence of gas diffusion and suggesting an exceptionally low deformation in the patterned acidic stamp. In traditional µCP diffusive wetting results in at least 50 nm ink spreading, even under optimal conditions.…”
Section: Icrocontact Printing (µCp) Was First Introduced Bymentioning
confidence: 91%
“…A dvances in nanoscience and technology increasingly rely on unconventional techniques for fabricating structures with nanometer dimensions (1)(2)(3). Patterning methods that have emerged from the microelectronics industry (photolithography, electron beam lithography, and others) are well suited for patterning 2D structures on ultraflat glass or semiconductor surfaces.…”
mentioning
confidence: 99%