Quad-band GSM Silicon PA Module on LTCC embedding a Coupler-based RF Power Controller

Pallotta, Andrea; Pidala, F.; Labate, L.; Moscatelli, Alessandro

doi:10.1109/mwsym.2007.380315

Cited by 4 publications

(1 citation statement)

References 3 publications

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“…Therefore, directional couplers are usually embedded in packaging substrates [7]. In this paper, LTCC packaging technology provided by RN2 Inc. was used to implement the module.…”

Section: Power Detectormentioning

confidence: 99%

Efficient Wi-Fi Power Amplifier LTCC Module Using a Buck Converter With a Power Inductor Implemented in Ferrite-Filled PCB Technology

Yoon

Dang

Lai

et al. 2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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This paper presents a power amplifier module (PAM) that operates efficiently in low-power mode for IEEE 802.11g Wi-Fi applications. The PAM consists of a power amplifier (PA), a buck converter, and a power detector. Two packaging technologies were used to integrate the compact module: a low-temperature co-fired ceramic (LTCC) technology and a ferrite-filled printed circuit board (PCB) technology. The LTCC portion includes radio-frequency inductors, capacitors, transmission lines, and interconnection lines to minimize the overall size, while a power inductor for the buck converter is implemented in ferrite-filled PCB. The PA and the buck converter are designed in 2-µm InGaP/GaAs heterojunction bipolar transistor technology and 0.35-µm CMOS technology, respectively. The output power level is converted into a voltage by the power detector, and the voltage controls the buck converter, thereby optimizing the supply voltage of the PA. This adaptive supply voltage helps to improve the power-added efficiency (PAE) in the low-power regime while maintaining linearity. The PAM showed an error vector magnitude of less than 4% up to an output power of 22 dBm. The PAE is 8% and 11% at output powers of 11 and 16 dBm, respectively, representing respective improvements of 60% and 43%. The overall size of the PAM is 5×7.5×1.2 mm 3 .Index Terms-Adaptive supply voltage, buck converter, ferrite-filled printed circuit board (PCB), low-temperature co-fired ceramic (LTCC), power amplifier (PA), power detector, power-added efficiency (PAE), WiFi.

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“…Therefore, directional couplers are usually embedded in packaging substrates [7]. In this paper, LTCC packaging technology provided by RN2 Inc. was used to implement the module.…”

Section: Power Detectormentioning

confidence: 99%