To ensure the integrity and sustainability of high‐temperature applications, the development of protective materials is actually one of the major challenge in materials science. In our study, we examined the effect of a TiC film interlayered between W‐xRe (x = 0, 5 or 25 at % Re) and SiC. The protection given by TiC layer was considered in the 1573–1873 K temperature range and for TiC thicknesses up to about 100 μm.