Realistic end-to-end simulation of the optoelectronic links and comparison with the electrical interconnections for system-on-chip applications

Kyriakis-Bitzaros, E.D.; Haralabidis, N.; Lagadas, M.; Georgakilas, A.; Moisiadis, Y.; Halkias, G.

doi:10.1109/50.956141

Cited by 56 publications

(24 citation statements)

References 25 publications

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“…Interestingly, the greatest reduction in power consumption of 97.1% and delay of 35.6% occurs as compared to [11]. The power consumption overhead in [11] is due to the edge emitting laser modulator at the transmitting edge and the photodiode and signal level restorer at the receiving end of the optical link. This comparison suggests that novel signaling schemes incorporating electrical interconnects outperforms optoelectronic solutions.…”

Section: Simulation Results and Comparisonmentioning

confidence: 99%

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Quasi-Resonant Interconnects: A Low Power, Low Latency Design Methodology

Rosenfeld

Friedman

2009

IEEE Trans. VLSI Syst.

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Abstract-Design and analysis guidelines for quasi-resonant interconnect networks (QRN) are presented in this paper. The methodology focuses on developing an accurate analytic distributed model of the on-chip interconnect and inductor to obtain both low power and low latency. Excellent agreement is shown between the proposed model and SpectraS simulations. The analysis and design of the inductor, insertion point, and driver resistance for minimum power-delay product is described. A case study demonstrates the design of a quasi-resonant interconnect, transmitting a 5 Gb/s data signal along a 5 mm line in a TSMC 0.18-m CMOS technology. As compared to classical repeater insertion, an average reduction of 91.1% and 37.8% is obtained in power consumption and delay, respectively. As compared to optical links, a reduction of 97.1% and 35.6% is observed in power consumption and delay, respectively.

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Section: Simulation Results and Comparisonmentioning

confidence: 99%

“…As an alternative to electrical interconnects and related electrical limitations, optoelectronic links [11] have been considered. Optical interconnections promise to achieve high bandwidth by providing high density parallel communication channels.…”

Section: Introductionmentioning

confidence: 99%

Quasi-Resonant Interconnects: A Low Power, Low Latency Design Methodology

Rosenfeld

Friedman

2009

IEEE Trans. VLSI Syst.

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“…This means that the presence of the photodetector layer will not cause the guided light to radiate ("leak") into the photodetector layer for large . The total normalized power that is coupled into the photodetector layer , where is given by (1) and is the length (along the -direction) of the photodetector, is shown in Fig. 5(a) and (b) as a function of the separation for and m, respectively, for both TE and TM incident polarizations and for both and m free-space wavelengths.…”

Section: A Evanescent Coupling Of Waveguide To Substrate-embedded Phmentioning

confidence: 99%

“…Under the leaky-mode description, the electromagnetic field in the waveguide for can be manifested by a complex propagation constant , and the optical field (electric or magnetic) can be expressed as , where corresponds to the field profile along the direction. The optical power that is radiated and absorbed into the embedded detector region can then be expressed as (1) where represents the percentage of the reflected power of the incident mode when it enters the photodetector region. The reflected power depends on the separation between the film layer and the photodetector layer.…”

Section: A Evanescent Coupling From Waveguide To Substrate-embedded mentioning

confidence: 99%

“…If low loss, high-speed, low-power, compact optical interconnections could be implemented at the board and module levels with simple interfaces, this could offer the designer a high-performance interconnect option in a relatively inexpensive board technology. A number of quantitative comparisons of interconnection performance have been published discussing electrical and optical interconnections [1]- [3]. A critical issue is how to integrate optical interconnections into an electrical interconnection system.…”

Section: Introductionmentioning

confidence: 99%

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