2016
DOI: 10.1063/1.4942212
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Recombination activity associated with thermal donor generation in monocrystalline silicon and effect on the conversion efficiency of heterojunction solar cells

Abstract: The recombination properties of the carrier lifetime-limiting center formed during the generation of oxygen-related thermal donors (so called “old” thermal donors) in n-type Czochralski silicon were determined over a wide range of thermal donors' concentrations. The procedure involved (1) determining the various energy levels associated with dopants with the help of temperature Hall effect measurements, (2) clarifying which energy level limits the carrier lifetime by temperature lifetime spectroscopy, and (3) … Show more

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Cited by 32 publications
(13 citation statements)
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“…But even for non‐gettered wafers, lifetime values are still largely acceptable for cell processing (>4 ms). The wafer resistivity is also significantly affected by this high‐temperature process (Figure B), most likely due to thermal donor annihilation or de‐activation . After gettering, both lifetime and resistivity show relatively flat profiles over the complete ingot length.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…But even for non‐gettered wafers, lifetime values are still largely acceptable for cell processing (>4 ms). The wafer resistivity is also significantly affected by this high‐temperature process (Figure B), most likely due to thermal donor annihilation or de‐activation . After gettering, both lifetime and resistivity show relatively flat profiles over the complete ingot length.…”
Section: Resultsmentioning
confidence: 99%
“…To potentially reduce even further recombination due to bulk transition metallic impurities (typically Fe, Cr, Ni, and Ti), half of the p ‐type wafers taken from each section of the ingot received at the very beginning of the cell process a high‐temperature POCl 3 gettering step (temperature between 810°C and 900°C), followed by a phosphorus silicate glass (PSG) removal and c‐Si etching step to remove the entire diffusion/gettering zone including all impurities gettered there . Note that before gettering, wafers close to the seed end of the ingot showed an inverse doping type (ie, n instead of p ) due to the presence of a high density of oxygen‐related thermal donors in this ingot region . All wafers were then textured in a potassium hydroxide (KOH) solution and wet‐chemically cleaned.…”
Section: Methodsmentioning
confidence: 99%
“…Low-lifetime areas have been successively observed as black cores [2], rings [1][2][3][4] or black edges [5] using various wafer and cell characterization techniques. Most of these features were related to oxygen (O)-containing defects such as thermal donors (small oxygen clusters featuring a donor character, referred to as TD) [6,7], oxygen precipitates (OP) [2], oxidation-induced stacking faults (OiSF) [8] or vacancy-O pairs (V-O) [9]. For these defects, the interstitial O concentration ([O i ]) can be seen in a simplified picture as the "driving force" for defect formation while thermal energy, characterized by a couple time (t) -temperature (T), governs the formation extent of the defects towards equilibrium.…”
Section: Introductionmentioning
confidence: 99%
“…Such phenomenon occurs at temperatures above 600°C [43] and is known to suppress recombination-active defects [44]. Complementary tests with very high passivation (i)/(n) stack (not shown) demonstrate that TD were shown to limit τ LIL at 2 ms at the concentration of 5 × 10 14 cm −3 [45]. Therefore, assuming samples to have the same interface recombination velocities for SHJ ref and SHJ 950ºC , TD dissolution is likely to explain the effective lifetime increase upon annealing.…”
Section: A-si:h Passivation On Boron-doped Surfacesmentioning
confidence: 89%