Reinforced Interfacial Interaction to Fabricate Poly(vinylidene fluoride) Composites with High Thermal Conductivity for Heat Exchangers

Abstract

The high interfacial thermal resistance, poor dispersion, and insufficient contact of the fillers in polymer-based composites result in a lower thermal conductivity, restricting the development of heat conduction and dissipation industrial application. In this paper, bioinspired modification of poly­(dopamine) (PDA) was applied to improve the interfacial adhesion performance of copper nanospheres (Cu) and carbon nanotubes (CNTs) in a poly­(vinylidene fluoride) (PVDF) matrix. The synergistic effect of Cu and CNTs with different dimensions was beneficial to the formation of a continuous heat conduction network. Moreover, CNTs could reduce the distance that linked the adjacent Cu with the PVDF matrix and fill the defect vacancies. The PVDF composite with 30 wt % Cu and 5 wt % CNT achieved a high thermal conductivity of 1.44 W/(m·K) and a tensile strength of 95 MPa. The simulation analysis of the model indicated that the interconnected architecture of the CNT/Cu/PVDF/PDA composite reduced the interfacial thermal resistance by the bridging effect of CNTs. The long-term heat-transfer test with the corrosive medium showed that a high-performance polymer heat exchanger will have great application potential in the field of waste heat recovering.

Constructing “sesame‐biscuit” structured hybrids with SiC and Ag particles for enhancing thermal conductivity and dielectric constant of elastomer composites

“…In recent years, the production of hybrid fillers by combining ceramic fillers and metal particles has become a reliable way to obtain polymeric composites with high λ values and excellent insulation at a low filler loading 14,19 . Zhao et al 20 constructed a continuous heat conduction path in polydimethylsiloxane (PDMS) matrix by adding a Cu and Ag layer functionalized Al 2 O 3 ‐based hybrid particles (denoted as Al 2 O 3 ‐Cu‐Ag).…”

“…18 In recent years, the production of hybrid fillers by combining ceramic fillers and metal particles has become a reliable way to obtain polymeric composites with high λ values and excellent insulation at a low filler loading. 14,19 Zhao et al 20 Cu-Ag particles reached a value of 1.4650 W/(mK), which was 651% higher than pure PDMS (0.1950 W/(mK)). Additionally, the AC conductivity of the PDMS composites was less than 10 À10 S/cm, showing good insulation.…”

“…Improving the thermal conductivity (λ) of a polymer is an effective and easy method to spread the accumulated heat in a quick way. 5,6 This can be realized by incorporating thermally conductive fillers including ceramic particles such as silicon carbide (SiC), 7,8 aluminum oxide (Al 2 O 3 ), 9,10 and boron nitride (BN), 11,12 carbon materials such as carbon nanotubes (CNT) 13 and graphene oxide (GO), 14,15 and metal particles such as silver (Ag) and copper (Cu) into a polymeric matrix. 16,17 Though a small amount of carbon materials and metal particles can substantially enhance the λ value of polymeric composites, the sharply increased electrical conductivity limits their applications in the field of insulation.…”

High erosion resistance thermoplastic polyurethanes composites fabricated via intercalation reinforced interfacial interaction

“…[23][24][25] DA can form a poly(dopamine) (PDA), and its modification enhances hydrogen bond interactions between the nanofiller and the polymeric matrix, thus improving the dispersion of the nanofiller. [26][27][28] Furthermore, it is wellknown that PDA coatings including catechol and ethylamino functional groups offer a valid method to strengthen the compatibility and the interfacial interaction between the nanofiller and matrix. 29 Up to now, in addition to surface modification ways, recent studies have demonstrated that one-dimensional (1-D) CNT could overcome dispersion problem by inhibiting the aggregation of GNP, forming effective 3-D conductive networks.…”

High thermal conductivity thermoplastic polyurethane/boron nitride/liquid metal composites: the role of the liquid bridge at the filler/filler interface

“…Recently, bridging technique has been used to modify the filler/filler or filler/polymer interfaces. [20][21][22][23][24][25] "Soft" blocks such as 0D nanoparticles, 22,[26][27][28][29] 1D nanotubes/nanowires/whisker [30][31][32][33][34][35][36] and 2D nanosheets, 23,[37][38][39] are employed to bridge "hard" heat fillers at filler/filler interfaces. ITR can be effectively reduced due to the thermal bridging of the fillers.…”