Reliability of electrically conductive adhesives

Kudtarkar, S.; Morris, James E.

doi:10.1109/isapm.2002.990378

Cited by 6 publications

(3 citation statements)

References 3 publications

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“…In the top picture, the Ag flakes are oriented randomly, except near the contact, as confirmed in the bottom picture which clearly shows some preferential alignment parallel to the contact. This sort of layered structure, shown schematically in Fig.4, has been previously demonstrated within ICAs [8,9].…”

Section: Structuresupporting

confidence: 58%

Interpretation of ICA mechanical cycling data

Morris

Niiranen

Mattila

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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Cyclic mechanical shear testing of isotropic conductive adhesives (ICAs) at ambient temperature reveals both viscoelastic behavior and a reproducible stress plateau. The failure mechanism is typically adhesive, rather than cohesive, which leads to significant deviations from the Coffin-Manson behavior expected. Tentative explanations of the viscoelasticity and plateau are offered in terms of filler particle movement and structural layering within the epoxy matrix.

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Section: Structuresupporting

confidence: 58%

Interpretation of ICA mechanical cycling data

Morris

Niiranen

Mattila

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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“…However, reliable bonding of components on low-cost foils is generally challenging, due to limited processing temperature range of the foils. Conductive adhesives with relatively low curing temperatures (typically 120-150 °C) are commonly used for component bonding on such foils [3][4][5]. While for a variety of applications conductive adhesives provide sufficient reliability, for more demanding applications such as automotive or wearables higher quality bonds are required.…”

mentioning

confidence: 99%

Hybrid integration on low-cost flex foils using photonic flash soldiering

Pakazad

Barink

Arutinov

et al. 2016

2016 6th Electronic System-Integration Technology Conference (ESTC)

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Soldering of packaged electronic components using industry standard Sn-Ag-Cu (SAC) lead-free solders on low-cost foils, which are often the substrate of choice for flexible electronics, is challenging. This is mainly originating from the fact that the reflow temperatures of these solder alloys are normally higher than the maximum processing temperature of the low-cost flex foils. To enable component integration on the low-cost foils a novel method for soldering has been introduced by Holst Centre as an alternative to oven reflow, termed "photonic soldering". In this method high intensity photonic flashes are used to deliver the thermal energy required for soldering. By taking advantage of the selectivity of light absorption, the required energy for soldering is delivered to the components and circuit tracks while excessive heating of the foils is avoided. This paper presents successful photonic flash soldering of packaged LED components on low-cost polyethylene terephthalate (PET) foils using conventional SAC solders as a demonstration of the capabilities of this novel soldering technology. IntroductionReliable integration of conventional electronic chips and passive components next to printed electronics on flexible foils enables realization of smart flexible systems with complex functionality [1,2]. To reduce the cost of such systems, low-cost flexible foils are preferred as the base substrate. However, reliable bonding of components on low-cost foils is generally challenging, due to limited processing temperature range of the foils. Conductive adhesives with relatively low curing temperatures (typically 120-150 °C) are commonly used for component bonding on such foils [3][4][5]. While for a variety of applications conductive adhesives provide sufficient reliability, for more demanding applications such as automotive or wearables higher quality bonds are required.Soldering has been commonly used in electronic industry for reliable component bonding on printed circuit boards (PCBs). However, the melting temperature of industry standard solder alloys such as lead-free Sn-AgCu (SAC) is above the maximum processing temperature range of low-cost foils such as polyester foils, which renders oven solder reflow on these foils practically impossible. Low-temperature solder alloys with melting temperatures below 150 °C such as SnBi alloys can be used as alternatives to SAC solders; however there are reliability challenges associated with low-temperature

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“…ICAs do not only provide a lead-free alternative to solder, they also provide a solution were solder is completely inadequate [4]. However, compared to soldering, ICA technology is still in its infancy [5]. Two critical issues of conductive adhesives for surface mount applications are the contact resistance shift during lifetime and a low impact performance.…”

Section: Introductionmentioning

confidence: 99%

Simulation of the aging behavior of isotropic conductive adhesives

Mundlein

Hanreich

Nicolics

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proc

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Although, in numerous studies the changes of contact resistance during accelerated aging under elevated temperature and humidity were observed there is still a lack of understanding of degradation mechanisms. Some models illustrate connections between the contact behavior and parameters of the conductive filler. In addition to these considerations in our paper we describe the macroscopic behavior by considering the microscopic resistance change between the conductive particles themselves and between parh'cles and contact pads. For this purpose, we calculated the electrical contact resistance with a two dimensional numeric simulation. Herein the conductive particles are modeled by randomly distributcd ellipses placed between two parallel electrodes comparable to silver flakes as known from metallographic: cross sections of our contact samples. The voltage and current distribution and the contact resistance as well are calculated by transfoming this model into a resistor network During a forced aging process different opposite effects occur in an adhesive joint. One effect is the increase of entire resistance due to a degradation of the interpam'cle contact. Another effect is the decrease of resistance caused by a post curing of the resin during aging of the adhesive joint. This behavior was experimentally determined in a previous investigation. In accordance to these effects we simulate the aging process of the joint by introducing different time dependencies of the interparticle resistance. The goal of this study is to provide a deeper understanding of the changes of the macroscopic contact behavior due to different environmental impacts.

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Reliability of electrically conductive adhesives

Cited by 6 publications

References 3 publications

Interpretation of ICA mechanical cycling data

Interpretation of ICA mechanical cycling data

Hybrid integration on low-cost flex foils using photonic flash soldiering

Simulation of the aging behavior of isotropic conductive adhesives

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