Reliable Sn–Ag–Cu lead-free melt-spun material required for high-performance applications

Abstract

This study investigates the structural, mechanical, thermal and electrical properties of B-1 JINHU, EDSYN SAC5250, and S.S.M-1 commercial materials, which have been manufactured at China, Malaysia, and Germany, respectively. The commercial materials have been compared with the measurements of Sn–Ag–Cu (SAC) melt-spun materials that are only indicative of what can be expected for the solder application, where the solder will have quite different properties from the melt-spun materials due to the effects of melt-spinning technique. Adding Cu to the eutectic Sn–Ag melt-spun material with 0.3 wt.% significantly improves its electrical and mechanical properties to serve efficiently under high strain rate applications. The formed Cu3Sn Intermetallic compound (IMC) offers potential benefits, like high strength, good plasticity, consequently, high performance through a lack of dislocations and microvoids. The results showed that adding 0.3 wt.% of Cu has improved the creep resistance and delayed the fracture point, comparing with other additions and commercial solders. The tensile results showed some improvements in 39.3% tensile strength (25.419 MPa), 376% toughness (7737.220 J/m3), 254% electrical resistivity (1.849 × 10−7 Ω · m) and 255% thermal conductivity (39.911 w · m−1 · k−1) when compared with the tensile strength (18.24 MPa), toughness (1625.340 J/m3), electrical resistivity (6.56 × 10−7 Ω · m) and thermal conductivity (11.250 w · m−1 · k−1) of EDSYN SAC5250 material. On the other hand, the Sn93.5–Ag3.5–Cu3 melt-spun solder works well under the harsh thermal environments such as the circuits located under the automobiles’ hood and aerospace applications. Thus, it can be concluded that the melt-spinning technique can produce SAC melt-spun materials that can outperform the B-1 JINHU, EDSYN SAC5250 and S.S.M-1 materials mechanically, thermally and electrically.

Development of a Novel Low-Silver Cu-P Brazing Filler Metal Bearing Sn

“…The decrease of both T s and T l was likely due to the fact that the melting point of Sn is only 231.9 • C. Appropriate amounts of Sn could dissolve in copper to form copper-based solid solutions with lower melting temperature, which is beneficial for the brazing of the H62 brass substrate. The effect of alloying elements on the thermal properties of solder has been reported elsewhere [17][18][19], and its mechanism is similar to that described in this study. Notably, the T s of the brazing filler metal was 560 • C when the amount of Sn addition exceeded 0.5 wt.%, indicating that the Cu-P-Ag-Sn quaternary eutectic structure of the novel low-silver filler metal had begun to emerge [20].…”

Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy

“…It is frequently used in estimating the mechanical properties of solid materials (Tang et al , 2014). A Vickers microhardness tester (Model FM-7, Japan) was used to investigate the creep indentation behaviour of the used materials using loads of 10, 25, 50 and 100 gf for dwell times up to 90 s. In this case, the following equation may be used (Shalaby et al , 2018; Jubair et al , 2019): …”

ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder

“…It is frequently used in estimating the mechanical properties of solid materials (Tang et al , 2014). A Vickers microhardness tester (Model-FM-7-Japan) was used to investigate the creep indentation behaviour of the materials used using loads of 10, 25, 50 and 100 gf for dwell times up to 90 s. In this case, the following equation can be used (Shalaby et al , 2018; Jubair et al , 2019): …”