Proceedings of International Electron Devices Meeting
DOI: 10.1109/iedm.1995.499229
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Reverse short channel effect and channel length dependence of boron penetration in PMOSFETs

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Cited by 15 publications
(10 citation statements)
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“…This alters the value of m in (12) and reduces S. In this specific process technology, the subthreshold slope of the proposed method is 71mV/dec which is 16mV lower than that of the conventional minimum channel device. The improved subthreshold slope reduces the off-current by 30% for the same on-current and increases the Ion-to-Ioff by a 2.5X, from 190 to 483 at 0.2V.…”
Section: Subthreshold Swing and Ion-to-ioff Ratiomentioning
confidence: 94%
See 1 more Smart Citation
“…This alters the value of m in (12) and reduces S. In this specific process technology, the subthreshold slope of the proposed method is 71mV/dec which is 16mV lower than that of the conventional minimum channel device. The improved subthreshold slope reduces the off-current by 30% for the same on-current and increases the Ion-to-Ioff by a 2.5X, from 190 to 483 at 0.2V.…”
Section: Subthreshold Swing and Ion-to-ioff Ratiomentioning
confidence: 94%
“…Traditionally, non-uniform HALO doping was used to mitigate this problem by making the depletion widths narrow and hence reducing the DIBL effect. As a byproduct of HALO, a short channel device shows RSCE behavior where the V th decreases as the channel length is increased [11] [12]. In subthreshold circuits, the SCE mechanism is not as strong as in superthreshold circuits.…”
Section: Introductionmentioning
confidence: 99%
“…Consequently, the degraded I on ‐to‐ I off ratio poses a significant adverse impact on robustness of the circuits. (ii) Some second‐order effects that are imperceptible or inconspicuous in super‐threshold domain are becoming utterly pronounced in sub‐threshold region. The representative ones encompass reverse short‐channel effect (RSCE) [15–17] and inverse narrow width effect (INWE) [18–20]. These two sub‐threshold effects cause non‐proportional relationship between the driven current and the width together with the length of the transistor.…”
Section: Introductionmentioning
confidence: 99%
“…(1) oxidation (Orlowski et al, 1987), (2) the damage from lightly doped drain (LDD) and source/drain (S/D) implants (Lutze and Venkatesan, 1995), (3) the electrical deactivation of arsenic (Rousseau Downloaded by [Nova Southeastern University] at 23:02 02 January 2015 et al., 1994 and 1997), (4) boron penetration from poly-gate and oxide (Subramanian et al, 1995). There are still other factors such as annealing (Wensheng et al, 2003) and salicide (Lu and Sung, 1989) within front end processes affecting the RSCE.…”
Section: Introductionmentioning
confidence: 99%