Proceedings of the Thirteenth Biennial University/Government/Industry Microelectronics Symposium (Cat. No.99CH36301)
DOI: 10.1109/ugim.1999.782849
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RF package characterization and modeling

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Cited by 5 publications
(2 citation statements)
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“…The entire time taken for the self-calibration depends on the number of taps in Lg; we show in this work that each tap requires about 3 us processing time. This compares very favorably to times taken by current commercial test schemes [8], wherein the testing period itself is in the order of hundreds of milliseconds.…”
Section: Merits Of This Architecturementioning
confidence: 70%
See 1 more Smart Citation
“…The entire time taken for the self-calibration depends on the number of taps in Lg; we show in this work that each tap requires about 3 us processing time. This compares very favorably to times taken by current commercial test schemes [8], wherein the testing period itself is in the order of hundreds of milliseconds.…”
Section: Merits Of This Architecturementioning
confidence: 70%
“…The rapid increase in circuit operating speeds, I/O pin count and functionality, coupled with the complex behavior of deep sub-micron devices, have placed unique challenges on the encompassing package. Furthermore, at radio frequencies, package parasitics are no longer negligible [8]: 3 (a) Interconnection of chip and package through bond-wires, (b) parasitics associated with the chip-package interface.…”
Section: Chip-package Co-designmentioning
confidence: 99%