“…Post-processing may include wire spreading within or across layers [2], via duplication [2,9], shifting [19] and widening [22], improvement of via metal overlap, wire and jog widening [1], and more [3,22]. Although many authors point out that, due to the switch from aluminum to copper metallization, opens today dominate over shorts failures [6,12], and wire widening is still mainly discussed only as a measure to improve electromigration [4,8] or timing [18] (with [1] as an early exception). SFF improves routing yield by concurrent wire spreading and fattening within one layer, with the following main distinctive features:…”