Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

Kunwar, Anil; Guo, Bingfeng; Shang, Shengyan; Råback, Peter; Wang, Yunpeng; Ma, Haitao; Song, Xin; Zhao, Ning

doi:10.1016/j.intermet.2017.11.021

Cited by 17 publications

(16 citation statements)

References 54 publications

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“…Compared with traditional Sn-Pb solder, Sn-Cu solders exhibit the higher melting point [14][15][16][17][18]. However, there is still potential for the further development of Sn-Cu solder alloys with higher properties.…”

Section: Introductionmentioning

confidence: 99%

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Zhao

Liu

Xiong

et al. 2019

Science and Technology of Advanced Materials

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With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/ solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research. This figure presents the interface morphology of Sn-Cu-Ni-xPr joint. (a) x = 0, (b) x = 0.05wt%. It was clear that with the addition of 0.05% Pr, the thickness of IMC layer decreases significantly and the formation of voids at the interface is inhibited.

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Section: Introductionmentioning

confidence: 99%

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Zhao

Liu

Xiong

et al. 2019

Science and Technology of Advanced Materials

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“…So it is extremely necessary to understand the growth behavior of interfacial IMC. The results show that the shear strength of prismatic IMC is higher than that of f scalloped grains 18 . Zhang et al 7 studied interface reaction mechanism during thermal cycling and isothermal aging.…”

Section: Introductionmentioning

confidence: 86%

“…As we all know, the solder joints reliability has an important relationship with the morphology and size of the interfacial intermetallic compound (IMC) 18 , 19 . So it is extremely necessary to understand the growth behavior of interfacial IMC.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Cui

Zhang

Zhao

et al. 2021

Sci Rep

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Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

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“…Eq. 1, along with incompressible Navier-Stokes equation were solved for a total simulation time of 120 s using finite element method (FEM) in Elmer software [12,13]. Paraview 5.0.1 [14] is utilized as the visualization or post-processing software.…”

Section: Transient Cu Concentration Distribution In Liquid Solder For Isothermal Stagementioning

confidence: 99%

“…where, p, ν and α are respectively the fluid pressure, dynamic viscosity and thermal expansivity of the liquid medium. The value of α for Sn solder is taken to be equal to 6.5 × 10 −5 K −1 [12]. In Eq.…”

Section: Variation Of Temperature and Velocity In Liquid Solder During Cooling Conditionmentioning

confidence: 99%

Geometrical Effects of Cu@Ag Core–Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints

Shang

Kunwar

Wang

et al. 2019

Electron. Mater. Lett.

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Solder ball of initial diameter 1.4 mm, was reflow soldered with Cu substrate at 523.15 K using flux doped with Cu@Ag core-shell nanoparticles (NPs) in the proportion 0 -2 wt. %. The solders were then air cooled to room temperature. The use of NPs, by reducing the base height (H) of the solder and enhanced the diameter (W) of the solder, caused an overall increase in the spread ratio of the solder. The altered magnitudes of heat and mass transfer in these geometrically different but constant volume specimens were analyzed using finite element method. The occurrence of differential concentration gradient, radial thermal gradient and velocity magnitudes, in solders with differing geometry were numerically elaborated. The Cu 6 Sn 5 intermetallic compound (IMC) formed at the Cu/Sn interface, was obtained to be the thickest for the specimen using undoped flux, whereas it was found to be smallest for the sample processed with flux containing 0.5 % NPs. From the growth kinetics

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Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

Cited by 17 publications

References 54 publications

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Geometrical Effects of Cu@Ag Core–Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints

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