1991
DOI: 10.1016/0169-4332(91)90376-u
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Secondary electron yield of SiO2 and Si3N4 thin films for continuous dynode electron multipliers

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Cited by 67 publications
(35 citation statements)
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“…(2) There is one experimental report of SEY of 2.9 at reflective mode at primary energy of 350 eV for LPCVD silicon nitride thin films [8]. (3) Mechanically stable and ultrathin (in order of 10 nm) silicon nitride films can be realized through MEMS technology [9].…”
Section: Introductionmentioning
confidence: 99%
“…(2) There is one experimental report of SEY of 2.9 at reflective mode at primary energy of 350 eV for LPCVD silicon nitride thin films [8]. (3) Mechanically stable and ultrathin (in order of 10 nm) silicon nitride films can be realized through MEMS technology [9].…”
Section: Introductionmentioning
confidence: 99%
“…A first test with such a coating in an AMCP led to an increase of the gain by a factor of 2 [102]. Possible alternatives to explore are SiO2, Si3N4 [106] or diamond-like layers [107]. [101].…”
Section: Amcp Performancementioning
confidence: 99%
“…These authors also report that ions with a higher energy induce the emission of multiple electrons from the MCP glass. Assuming the MCP axial accelerating field is sufficiently strong (~1 kV/mm), so that each secondary electron striking the MCP wall has an energy above the threshold value of about 20-30 eV [10], an avalanche of electrons will subsequently be produced. Standard photon or particlecounting MCP detectors operate at gains of about 10 6 -10 7 , and various readout options have been developed depending upon the specific combination of detector parameters desired (such as counting rate, spatial resolution requirements, need for multi-particle detection, etc.).…”
Section: Neutron Detection Efficiency For a Single Neutronmentioning
confidence: 99%
“…For example, it is desirable to minimize the channel wall thickness in order to maximize the escape probability P 2 of the reaction products. However, the MCPs having the thinnest channel walls, corresponding to the smallest channel diameters (2 microns, available commercially from Burle [16]), represent a considerable technological achievement in its own right, given the fragility of submicron glass channel walls and the very high applied 17 fields (~10 kV/mm) that must be sustained across the MCP glass, needed to accelerate secondary electrons above the first crossover potential (~20 eV) before striking the opposing channel wall [10]. Unfortunately, one of the essential MCP manufacturing steps of acid core etch becomes essentially impossible for large L MCP /d ratios (>500:1), especially given the presence of boron, which only increases acid solubility.…”
Section: Model Predictionsmentioning
confidence: 99%
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