MTT-S International Microwave Symposium Digest
DOI: 10.1109/mwsym.1976.1123637
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Series Interconnection of Six TRAPATT Devices on a Diamond Substrate

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“…There are several challenges and technological hurdles that must be resolved before diamond-based MCMs become a reality [6]. Cox et al reported the effects of package parasitic on series interconnections of TRAPATT diode chips on diamond substrates have been studied via time-domain computer simulations and experiments at frequencies from 2 to 9 GHz [7].…”
Section: Introductionmentioning
confidence: 99%
“…There are several challenges and technological hurdles that must be resolved before diamond-based MCMs become a reality [6]. Cox et al reported the effects of package parasitic on series interconnections of TRAPATT diode chips on diamond substrates have been studied via time-domain computer simulations and experiments at frequencies from 2 to 9 GHz [7].…”
Section: Introductionmentioning
confidence: 99%