ISPSD '03. 2003 IEEE 15th International Symposium on Power Semiconductor Devices and ICs, 2003. Proceedings.
DOI: 10.1109/ispsd.2003.1225252
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Short circuit properties of Trench-/Field-Stop-IGBTs-design aspects for a superior robustness

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Cited by 39 publications
(42 citation statements)
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“…2 shows a severe wafer warpage of 32 mm could be induced when the ultra thin wafers were coated with a thin layer of solder. IGBT with field stop (FS) structure offers a superior tradeoff between static and dynamic losses as compared with Punch-Through (PT) -IGBTs [5]. The typical thickness of 650V FS IGBT is in the range of 65 -75 um.…”
Section: Introductionmentioning
confidence: 99%
“…2 shows a severe wafer warpage of 32 mm could be induced when the ultra thin wafers were coated with a thin layer of solder. IGBT with field stop (FS) structure offers a superior tradeoff between static and dynamic losses as compared with Punch-Through (PT) -IGBTs [5]. The typical thickness of 650V FS IGBT is in the range of 65 -75 um.…”
Section: Introductionmentioning
confidence: 99%
“…During short-circuit, the electrical runaway can occur at any distinct time leading in the most cases to the device failure. Depending on the device switching conditions, several types of shortcircuit can occur [1][2][3][4][5][6][7][8][9][10][11][12][13][14]. Almost no detail can be found in the literature concerning the device internal behaviour under the proposed short circuit event [6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…The failure mode A occurs at the beginning of the short circuit during the turn on. The reason can be the high applied voltage leading to early breakdown or to the latch-up phenomenon [4,5,12]. The failure mode B occurs during the on state of the device, between turn on and turn off.…”
Section: Introductionmentioning
confidence: 99%
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“…The dependence of the electric field on the effective background doping of modern SPT type IGBTs structures has led to the device experiencing new failure modes during turn-off as well as during short circuit operation of the IGBT [5]. The high levels of conducting electrons due to short circuit operation or pn-junction avalanche during turn-off can result in unbalanced carrier concentrations in the n-base.…”
Section: Spt Design For Safe Sscm Performancementioning
confidence: 99%