SiGe HBTs in 90nm BiCMOS Technology Demonstrating fT/fMAX 285GHz/475GHz through Simultaneous Reduction of Base Resistance and Extrinsic Collector Capacitance
Abstract:Development of SiGe HBTs in BiCMOS technology with both high f
T and f
MAX faces significant challenges. To increase f
T, thinning the base and collector thickness is generally the first step to reduce the carrier transit times, but this increases the base resistance and the collector-base capacitance, which impacts f
MAX negatively. Increasing collector doping is also often employed to increase f
T, but this increases co… Show more
“…The current state-of-the-art performance level for the DPSA design is represented, for example, by STMicroelectronics' 55 nm SiGe BiCMOS technology featuring peak f T /f max /gate-delay values of 320 GHz/370 GHz/ 2.34 ps [1]. By the help of non-standard technology elements the feasibility of f max values around 500 GHz could be shown [6]- [9]. The recently proposed SEG HBT process in which an epitaxial base link (EBL) is formed after emitter fabrication [7] offers a potential way to overcome limitations of the classical DPSA technology in forming a more conductive baselink suitable for ongoing lateral scaling.…”
The high-frequency performance of a novel SiGe HBT module with mono-crystalline base link is investigated in an industrial 0.13 µm BiCMOS environment. The main feature of this new HBT module is a significant reduction of the external base resistance as shown here by direct comparison with a conventional double-poly-silicon technology. Peak f T /f max values of 300 GHz/500 GHz are achieved. A minimum CML ring oscillator gate delay of 1.8 ps and a record operation frequency for a SiGe static frequency divider of 161 GHz are demonstrated.
“…The current state-of-the-art performance level for the DPSA design is represented, for example, by STMicroelectronics' 55 nm SiGe BiCMOS technology featuring peak f T /f max /gate-delay values of 320 GHz/370 GHz/ 2.34 ps [1]. By the help of non-standard technology elements the feasibility of f max values around 500 GHz could be shown [6]- [9]. The recently proposed SEG HBT process in which an epitaxial base link (EBL) is formed after emitter fabrication [7] offers a potential way to overcome limitations of the classical DPSA technology in forming a more conductive baselink suitable for ongoing lateral scaling.…”
The high-frequency performance of a novel SiGe HBT module with mono-crystalline base link is investigated in an industrial 0.13 µm BiCMOS environment. The main feature of this new HBT module is a significant reduction of the external base resistance as shown here by direct comparison with a conventional double-poly-silicon technology. Peak f T /f max values of 300 GHz/500 GHz are achieved. A minimum CML ring oscillator gate delay of 1.8 ps and a record operation frequency for a SiGe static frequency divider of 161 GHz are demonstrated.
“…HBT architectures in volume production today are limited to an fmax of up to 400GHz (1),( 2),(3),(4), (5), (6). Alternative HBT architectures to overcome this limitation have been proposed (7), (8), (9), (10).…”
In this contribution we report the successful integration of a SiGe HBT module with fT = 300GHz, fmax = 480GHz in a 90nm BiCMOS technology platform. Building on previous studies by IHP and Infineon the Epitaxial-Base-Link process flow was further adapted for compatibility to the 90nm CMOS base technology.
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