Photodetectors 2012
DOI: 10.5772/36014
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Silicon Photodetectors Based on Internal Photoemission Effect: The Challenge of Detecting Near-Infrared Light

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Cited by 7 publications
(7 citation statements)
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“…The Au/SiNH device containing the thinnest plasmonic coating layer (i.e., the 20 nm case) has a C F value of 0.12, higher than the other two cases. This finding provides clear evidence that thinning down the thickness of plasmonic absorber can efficiently improve the probability of hot electron ejection, regarding on the finite mean free path of the electrons in metals. , As illustrated in the inset of Figure c, we observed an IQE approaching 1.7% at the band edge of silicon, which is much higher than the values reported by previous antennas or grating-Schottky photodetector in the wavelength region where silicon does not absorb. , Apart from the dependency of IQE on the thickness, the impact of the spatial distribution of the plasmonic absorption is also critical. This is already apparent when comparing the responsivity of the planar reference with the Au/SiNH devices.…”
Section: Spectral Responsivity Of the Hot Electron Conversionsupporting
confidence: 56%
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“…The Au/SiNH device containing the thinnest plasmonic coating layer (i.e., the 20 nm case) has a C F value of 0.12, higher than the other two cases. This finding provides clear evidence that thinning down the thickness of plasmonic absorber can efficiently improve the probability of hot electron ejection, regarding on the finite mean free path of the electrons in metals. , As illustrated in the inset of Figure c, we observed an IQE approaching 1.7% at the band edge of silicon, which is much higher than the values reported by previous antennas or grating-Schottky photodetector in the wavelength region where silicon does not absorb. , Apart from the dependency of IQE on the thickness, the impact of the spatial distribution of the plasmonic absorption is also critical. This is already apparent when comparing the responsivity of the planar reference with the Au/SiNH devices.…”
Section: Spectral Responsivity Of the Hot Electron Conversionsupporting
confidence: 56%
“…Unfortunately, carrier transport and ejection in metals are relatively unefficient processes compared to semiconductor materials, manifesting in previously reported ultralow IQE especially for NIR wavelengths (less than 1%). , As a consequence, the photon-to-electricity efficiency of hot electron devices relies more heavily on their electrical design. Since the mean free path of hot electron in metal in only several to several tens nanometers, , it has been reported that the plasmonic resonance with high field localization (i.e., hot spots) adjacent to the barrier of MS or MIM can significantly increase the collection possibility of hot electrons . Furthermore, it is possible to gain IQE enhancement with shortened transporting path of energetic carriers by straightforwardly thinning down the thickness of plasmonic absorber layer. , Concerning the importance of hot electron extraction, a framework for systematically analyzing the impacts of hot spots control and plasmonic absorber thickness is needed.…”
mentioning
confidence: 99%
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“…E xtracting energetic carriers from light absorption in socalled hot carrier Schottky barrier (SB) junctions has attracted enormous attention, as it allows harvesting low photon energies that have so far been omitted from semiconductor photodetectors. 1−8 Since metals offer zero bandgap energy, their operation can in principle cover visible, mid-infrared, terahertz, and microwave regimes, which holds great promises for gas detection, 9,10 imaging sensors, 11 wavelength determination, 12,13 power monitoring, 14 and sustainable power supplies. 15−17 Taking silicon photodetectors (with a bandgap energy of 1.1 eV) 18 for instance, exploitation of SB devices can result in a highly integrated CMOScompatible and inexpensive alternative to commercially used germanium (Ge) and gallium arsenide (GaAs) photodetectors at telecommunication wavelengths.…”
mentioning
confidence: 99%
“…Indeed, IPEbased PDs are very fast thanks to the unipolar nature of the Schottky junction, and they have already shown the capability to be monolithically integrated with Si-based charge coupled devices for infrared applications [24]. IPE-based Si PDs were already summarized in a previous work of some years ago [25].…”
Section: Introductionmentioning
confidence: 99%