“…This includes SiO 2 layers prepared by ALD [13,28] and by plasmaenhanced chemical vapor deposition (PE-CVD) [20], thermallygrown SiO 2 [29], but also other materials such as HfO 2 [30]. Moreover, when SiO 2 is combined with other capping layers, such as in SiO 2 /SiN x or SiO 2 /Al 2 O 3 /SiN x stacks, very low charge densities can be obtained [7,29,31], although this strongly depends on the SiO 2 thickness and process conditions [7,29]. To achieve passivation of n þ and p þ Si surfaces, for example wet-chemical or PE-CVD SiO 2 films in combination with PE-CVD SiN x capping layers [19,22], and PE-CVD SiO 2 /Al 2 O 3 stacks with varying SiO 2 film thicknesses have been studied [20].…”