Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds

Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package

“…9 shows the bottom view of the knit lines. Schreier-Alt et al [11] reported this phenomenon, which caused the void in the MAP, in their experimental analysis. Fig.…”

“…However, the occurrence of void formation reduces package reliability during the encapsulation process. This problem was mentioned in various IC encapsulation processes, such as the thin quad flat package (TQFP) [3,4], TSOP II 54L LOC [5,6], stacked-chip scale package (S-CSP) [7][8][9][10], mold array package (MAP) [11], and molded underfill [12].…”

“…The void formation was found to increase with the number of stacking chips in S-CSP packaging. Recently, Schreier-Alt et al [11] have studied the simulation and experimental analyses on the MAP. They reported that the voids form in the contact area between the separate flows (weld line) and that the non-homogeneous flow front causes the void formation.…”

Application of machine learning methods in the analysis of interface bonding strength for overmolded hybrid thermoset‐thermoplastic composites

“…Hubmann et al 16 employed Moldflow software to explore the impact of melt temperature, mold temperature, and injection speed on component pressure and shear loads during injection molding. Schreier‐Alt et al 17 analyzed polymer flow velocities and pressure variations in the overmolding process with different mold cavity heights by Moldflow software. However, due to the complexity of composite material components, modeling and simulation studies pose challenges, and their accuracy and reliability can be questionable 18 .…”

Moldflow simulation of an exposed pad leaded package

“…The mold chase is typically maintained at melting temperature of the mold compound which initiates the flow inside the mold cavity and further reaction kinetics of the compound initiates the curing process. The transfer molding process has been used for encapsulating different kind of packages such as mold array package (MAP) [1] and ball grid array packages (BGA) [2]. The fluid flow behavior for a mold compound depends on material characteristics as well as the process control parameters.…”