Sn-Zn/Ni-Co Interfacial Reactions at 250°C

Lin, Hsin-Fu; Chang, Ya-chun; Chen, Chih-Chi

doi:10.1007/s11664-014-3232-0

Cited by 6 publications

(3 citation statements)

References 33 publications

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“…In most cases, only an IMC layer forms at the interface at first, even when solder reacts with binary substrate, because one element in substrate would dominate the interfacial reaction. For example, Ni is the dominant reaction element in Ni-20Cu and Ni-40Cu substrates when soldering at 250 • C. Similar to the reaction product formed in the Sn-Zn/Ni joint [21,36], Ni 5 Zn 21 is still the first formed product in the Sn-Zn/Ni-20Cu and Sn-Zn/Ni-40Cu joints.…”

Section: Discussionmentioning

confidence: 88%

“…and Au-20Sn or Sn-Cu solders has been extensively studied [21][22][23][24]. Cu alloying in Ni substrate alters the reaction path and induces the formation of thin uniform IMC layers, thereby improving the mechanical reliability of soldered joint [20].…”

Section: Methodsmentioning

confidence: 99%

“…Multielement substrate provides an effective way to change IMC species, morphology, and growth kinetics [19][20][21]. The interfacial reaction between Ni(Cu) or Ni(Co) multielement substrates, and Au-20Sn or Sn-Cu solders has been extensively studied [21][22][23][24]. Cu alloying in Ni substrate alters the reaction path and induces the formation of thin uniform IMC layers, thereby improving the mechanical reliability of soldered joint [20].…”

Section: Introductionmentioning

confidence: 99%

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Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints

Zhu

Peng

Wei

et al. 2019

Metals

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Sn-9Zn solder is a promising Pb-free solder, but it tends to form bulky intermetallic compounds (IMC) grains at the interface when soldered with common simple metal Cu or Ni substrates. Interfacial reaction between Sn-9Zn solder and Ni(Cu) solid solution substrates at 250 °C and 350 °C were systematically probed in this study. Results showed that when soldered at 250 °C, a Ni5Zn21 layer is formed at Sn-Zn/Ni-20Cu and Sn-Zn/Ni-40Cu joints; and Ni2Sn2Zn + Cu5Zn8 and Cu5Zn8 phases are formed in Sn-Zn/Ni-60Cu and Sn-Zn/Ni-80Cu joints, respectively. Fine-grained IMCs formed at the interface are formed even when the soldered time is prolonged to 16 h. This result indicates that Ni(Cu) solid solution substrates inhibit the rapid growth of IMC at the Sn-Zn/Ni-Cu interface. Ni(Cu) solid solution substrate can also provide various combinations of reaction products at the Sn-Zn/Ni-Cu joints. The Ni5Zn21 transfers to Ni2Sn2Zn + Cu5Zn8 phases when the Cu content increased to 60%, and a bi-layered structure Ni2Sn2Zn + Cu5Zn8 IMCs was formed in Sn-Zn/Ni(Cu) joints at 350 °C regardless of the Cu content in Ni(Cu) substrate (20–80%). These results would provide an effective support in designing Sn-Zn soldering system with optimized IMC layer to improve mechanical performance.

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Section: Discussionmentioning

confidence: 88%