2012
DOI: 10.1016/j.orgel.2012.05.016
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Stable organic thin-film transistors using full solution-processing and low-temperature sintering silver nanoparticle inks

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Cited by 31 publications
(17 citation statements)
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“…There are two major approaches for suppressing the bias‐stress effect. One is to reduce trap sites in the semiconductor layer such as by physically eliminating them with thermal annealing , and the other is to improve the semiconductor/dielectric interface, e.g ., by reducing roughness at the interface , forming self‐assembled monolayer modification on dielectric surfaces , or using hydroxyl‐free amorphous fluoropolymers as gate dielectric layers .…”
Section: Introductionmentioning
confidence: 99%
“…There are two major approaches for suppressing the bias‐stress effect. One is to reduce trap sites in the semiconductor layer such as by physically eliminating them with thermal annealing , and the other is to improve the semiconductor/dielectric interface, e.g ., by reducing roughness at the interface , forming self‐assembled monolayer modification on dielectric surfaces , or using hydroxyl‐free amorphous fluoropolymers as gate dielectric layers .…”
Section: Introductionmentioning
confidence: 99%
“…The width to length ratio ( W / L ) of the FET devices is 100/1. The main reason for using silver as the electrode metal is due to its great potential in printable electronics: solution‐processable silver nanoparticle ink can be sintered at a low temperature of 100 °C or less . Moreover, silver is a much cheaper metal than gold, a widely used electrode metal for OFET devices.…”
Section: Resultsmentioning
confidence: 99%
“…In most solution-processed devices, the electrodes are usually deposited by thermal evaporation or sputtering. To achieve a fully solution-processed OFET, for scalability and commercialization purposes, silver nanoparticles were deposited from solution and sintered to fabricate the electrodes [ 30 ]. This is applicable to all thin film devices; however, in this approach, achieving suitable ohmic contact between the electrode and the underlying layer is a challenge.…”
Section: Thin Film Transistorsmentioning
confidence: 99%