Subsurface deformation of steel by solid particle impact investigated by ion beam slope cutting and scanning electron microscopy

Hübner, Wolfgang; Hauffe, W.

doi:10.1016/0043-1648(95)06629-2

Cited by 4 publications

(4 citation statements)

References 17 publications

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“…In the zenith position of the cut after selective etching, the initial surface shows its microstructure in direct correspondence to the cut area, as demonstrated also on deformed steel. 3 Also, smoothing steps or additional cutting in new positions can be performed easily. One can go step by step through a selected region for full three-dimensional characterization.…”

Section: Methodsmentioning

confidence: 99%

Combined application of ion beam slope cutting and SEM/EDX for investigation of the surface layer system on tungsten microwires after tribological treatment

Hauffe

Pannicke

Däbritz

et al. 2002

Surface & Interface Analysis

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The surface layer system on tungsten wires developed after different technological processing steps and depending on the tribological treatment during the production technology has been investigated. The ion beam slope cutting (IBSC) technique in combination with scanning electron microscopy (SEM) and energy-dispersive x-ray (EDX) analysis has been applied for full three-dimensional determination of the phase and grain microstructure of the border zones of tungsten wires. The IBSC technique was changed for wire-shaped samples and modified by additional ion beam processing steps to characterize the near-surface regions of microwires. Transversal and longitudinal cuts through the border zones of the microwires have been performed for SEM observation and EDX microanalysis of the cut areas. The inhomogeneous three-dimensional distribution of tungsten oxide and graphite (as a lubricant) as well as the fine-grained tungsten structure could be determined with SEM resolution.

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Section: Methodsmentioning

confidence: 99%

Combined application of ion beam slope cutting and SEM/EDX for investigation of the surface layer system on tungsten microwires after tribological treatment

Hauffe

Pannicke

Däbritz

et al. 2002

Surface & Interface Analysis

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“…Ion sputtering is a relatively low damage process that preserves the details of hard-to-prepare microstructures like those composed of both soft and hard phases, and the depth of the damage layer is often small enough to permit the usage of surface-damage sensitive techniques such as electron backscattered diffraction (EBSD). 17,[26][27][28] These qualities have spurred interest in developing broad ion beam-based serial sectioning instruments 29 (i.e., those that utilize a cross-section polishing process termed 'slope-cutting' 30 ). Broad ion beam devices offer the potential for sputtering much larger areas compared to conventional liquid-metal ion source FIBs, which should bridge the size-scale gap between ion sputtering methods and the aforementioned polishing/microtome-milling/ablation devices.…”

Section: Serial Sectioning Instruments For Nano-to-micro Scale Featuresmentioning

confidence: 99%

Automated serial sectioning methods for rapid collection of 3-D microstructure data

Uchic

Groeber

Rollett

2011

JOM

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“…The methodology is inspired by an ion sputtering process developed by Hauffe and Hubner in the mid-1990's, termed slope-cutting, 15 which uses a physical mask with a well-defined edge, such as a knifeedge blade used for machine tooling, and a broad ion beam source to prepare a cross-section surface. The physical mask protects one portion of the sample while the edge defines the location of a cross-section surface that is created when the remainder of the sample is eroded by the ion beam.…”

Section: Introductionmentioning

confidence: 99%

Stencil mask methodology for the parallelized production of microscale mechanical test samples

Shade

Kim²,

Wheeler³

et al. 2012

Review of Scientific Instruments

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A new methodology to parallelize the production of micromechanical test samples from bulk materials is reported. This methodology has been developed to produce samples with typical gage dimensions on the order of 20-200 μm, and also to minimize the reliance on conventional focused ion beam fabrication methods. The fabrication technique uses standard microelectronic process methods such as photolithography and deep-reactive ion etching to create high aspect ratio patterned templates-stencil masks-from a silicon wafer. In the present work, the stencil mask pattern consists of a linear row of tensile samples, where one grip of each sample is integrally attached to the bulk substrate. Once fabricated, the stencil mask is placed on top of a pre-thinned substrate, and the pattern and substrate are co-sputtered using a broad ion beam milling system, which ultimately results in the transfer of the mask pattern into the substrate. The methodology is demonstrated using a Si stencil mask and a polycrystalline Ni foil to manufacture an array of metallic micro-tensile samples.

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Subsurface deformation of steel by solid particle impact investigated by ion beam slope cutting and scanning electron microscopy

Cited by 4 publications

References 17 publications

Combined application of ion beam slope cutting and SEM/EDX for investigation of the surface layer system on tungsten microwires after tribological treatment

Combined application of ion beam slope cutting and SEM/EDX for investigation of the surface layer system on tungsten microwires after tribological treatment

Automated serial sectioning methods for rapid collection of 3-D microstructure data

Stencil mask methodology for the parallelized production of microscale mechanical test samples

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