The Analysis of the Cu Surface Morphology Evolution During Electropolishing

Abstract

The work examining the evolution of the rough Cu surface morphology during the electropolishing process is presented. The surface width, w, is measured for different length scale, l, and time of the electropolishing experiments, t, and the data are analyzed within the scope of the scaling concept and predictions of electropolishing theory. The experimental data indicates that surface width as a function of the length scale maintains two scaling regimes (l l C ; w ~ l C and, l l C ; w const). The roughness exponents ( ), extracted from the data obtained for different polishing times show the time dependence described by linear regression. The decrease of surface width with polishing time is well described by exponential decay predicted by the mathematical model of an ideal electropolishing process. The semi-empirical function is proposed to describe the surface width decrease during the electropolishing and the example of its practical application is discussed.

Effect of Substrate Roughness and Feedstock Concentration on Growth of Wafer-Scale Graphene at Atmospheric Pressure

“…The dried Cu foil was then soldered to a metal wire, and covered with silicone gel on the back, edges, and corners. The Cu foil was then placed into an 800 mL beaker, containing a solution of 300 mL of H 3 PO 4 (80%) and 100 mL of poly(ethylene glycol) (PEG, molecular weight 400, from Sigma Aldrich Co.). , The Cu foil and a large Cu plate were used as work (+) and counter (−) electrode, respectively. A voltage of 1.0−2.0 V was maintained for ∼0.5 h during the polishing process.…”