The effect of adding Zn into the Sn–Ag–Cu solder on the intermetallic growth rate

Microstructural modifications and properties of low-Ag-content Sn–Ag–Cu solder joints induced by Zn alloying

“…Cu IMC particles are commonly present in near eutectic SAC solders, and could lead to untimely failure owing to the high interfacial energy between solid solder and IMC particles [16]. In Fig.…”

Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes

“…Meanwhile, after subjecting the solder joints to isothermal aging process, a new Cu 3 Sn IMC layer in contrast to the already existing Cu 6 Sn 5 IMC layer emerged. Mayapan et al proposed that Cu 6 Sn 5 IMC layer is thermodynamically unstable due to the lower activation energy of this layer relative to the Cu 3 Sn IMC layer [30]. Thus, the Cu 3 Sn IMC layer evolved over time with respect to the aging temperature by depleting the Cu 6 Sn 5 IMC.…”

Effects of titanium on active bonding between Sn3.5Ag4Ti(Ce,Ga) alloy filler and alumina

“…Nowadays, among many Pb-free solders, SnAgCu alloy system has been regarded as a promising candidate due to the merit of high strength, longer thermal fatigue life, good creep resistance, and low cost [1]. Although this alloy system shows a satisfactory wettability and solderability with many metallic substrates, it cannot be used for the bonding of ceramic materials without pre-metallization.…”