2012
DOI: 10.1109/tpel.2012.2183390
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The Impact of Parasitic Inductance on the Performance of Silicon–Carbide Schottky Barrier Diodes

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Cited by 56 publications
(26 citation statements)
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“…The measurements were performed in clamped inductive switching test rig [32]- [34], the schematic of which are shown in Figure 2 and the picture of the HV test rig is shown in Figure 3. For measurements that require a pre-defined ambient temperature, a Tenney environmental series 942 is used to monitor and maintain the ambient temperature within the specified levels.…”
Section: Experimental Measurements On Body Diodesmentioning
confidence: 99%
“…The measurements were performed in clamped inductive switching test rig [32]- [34], the schematic of which are shown in Figure 2 and the picture of the HV test rig is shown in Figure 3. For measurements that require a pre-defined ambient temperature, a Tenney environmental series 942 is used to monitor and maintain the ambient temperature within the specified levels.…”
Section: Experimental Measurements On Body Diodesmentioning
confidence: 99%
“…the R G = 15 Ω measurements shows less dependence of V AK on temperature. Previous publications have shown a temperature invariance of the SiC Schottky diode turn-OFF characteristics [14]; however, this was demonstrated at low gate resistance (R G = 2.5 Ω) as is the case in Figure 17. At slower switching rates (larger gate resistances); the dependence of dI DS /dt on temperature affects the diode temperature characteristics as shown in Figure 16 In other words, the rate at which the transistor switches will determine the response of the diode to the discharge of the free-wheeling current.…”
Section: Diode Switching Analysismentioning
confidence: 70%
“…However, advances in packaging technologies are not catching up with devices. Parasitic inductances in power modules induce electromagnetic oscillations in output characteristics which can be detrimental through the additional losses and reduced reliability [14]- [18]. These parasitic inductances depend strongly on the architecture of the power module and its layout.…”
Section: Introductionmentioning
confidence: 99%
“…However, although diode reverse recovery process is eliminated by using SiC SBD, the effects caused by junction capacitance are still present. Since the drift layer of a SiC SBD is thinner than Si diode, with the same chip area, the junction capacitance of SiC SBD is larger than Si diode [4]. Due to the extremely fast recovery process of SiC SBD and the resonance between the junction capacitance of SiC Nan Zhu, Xingyao Zhang, Min Chen, and Dehong Xu are with College of Electrical Engineering, Zhejiang University, Hangzhou, China, Seiki Igarashi, Tatsuhiko Fujihira are with Fuji Electric Co., Ltd., Japan (e-mail: xdh@zju.edu.cn).…”
Section: Transconductance Of the Igbt E Onmentioning
confidence: 99%