The Incidence and Avoidance of Gassing Defects in Chemical and Electropolishing of Aluminium

Clifford, A. W.; Arrowsmith, D. J.

doi:10.1080/00202967.1978.11870451

Cited by 10 publications

(2 citation statements)

References 3 publications

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“…Similar structures occur in both ECM and EP, in case dissolution is accompanied by pit formation 101,102 or gas evolution. 21,103,104 In addition, such local variations in flow rate may lead to partial passivation and uneven polishing. 16,101 By necessity, the influence of such hydrodynamic effects is magnified in TMEMM, where localized metal removal results in height differences along the surface over time.…”

Section: Surface Finishmentioning

confidence: 99%

“…Take for instance TMEMM of aluminum in hot, concentrated phosphoric acid. 162 On the one hand, aluminum reacts immediately upon immersion, leading to vigorous gas evolution and gassing defects, 104 unless precautions are taken. On the other hand, electrically isolated parts of an aluminum sample will continue to dissolve; 161 thus, island formation is less problematic.…”

Section: Metals and Electrolytesmentioning

confidence: 99%

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Review—Through-Mask Electrochemical Micromachining

Baldhoff

Nock

Marshall

2018

J. Electrochem. Soc.

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Through-mask electrochemical micromachining (TMEMM) is a versatile microfabrication technique, which combines anodic metalshaping and -finishing steps in a single operation for the purpose of microstructuring a wide range of electrically conductive materials. It has been extensively utilized for the manufacture of precision-engineered components in microsystems, such as microlenses, microprobes, microactuators, microchannels and microvalves. This is because TMEMM is able to mass-produce parts; it is applicable to difficult-to-etch materials and operable under polishing conditions. This review provides an in-depth summary of the current state of TMEMM and presents key concepts relevant to its application. To this end, the interplay between the current distribution, mass-transfer effects and surface-film formation is discussed, and its effect on the machining rate, shape profile and surface finish is highlighted. Also, past incarnations of TMEMM are reviewed in terms of their masking method, substrate material, electrolyte composition and technical application. Techno-economic aspects of TMEMM are debated in relation to potential rival techniques, taking microreactor fabrication as an example for a novel area of application. This is followed by an overview of process variations and recent developments.

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