Abstract.A semi-quantitave model describing the influence of interfaces and stress fields on {ll3}-defect generation in silicon during 1-MeV electron irradiation, is further developed to take into account also the role of extrinsic point defects. It is shown that the observed distribution of { 113}-defects in high-flux electron-irradiated silicon and its dependence on irradiation temperature and dopant concentration can be understood by taking into account not only the influence of the surfaces and interfaces as sinks for intrinsic point defects but also the thermal stability of the bulk sinks for intrinsic point defects. In heavily doped silicon the bulk sinks are related with pairing reactions of the dopant atoms with the generated intrinsic point defects or related with enhanced recombination of vacancies and self-interstitials at extrinsic point defects. The obtained theoretical results are correlated with published experimental data on boronand phosphorus-doped silicon and are illustrated with observations obtained by irradiating cross-section transmission electron microscopy samples of wafers with highly doped surface layers. PACS: 61.80.Fe, 61.70.Bv, 61.70.Yq Irradiation of electronic devices with high energy particles leads to a degradation of the device characteristics which is partly due to the creation of lattice damage in the active areas of the devices. A convenient way of studying the basic mechanisms of the formation of radiation-induced displacement damage is irradiation with MeV electrons which is known to create individual intrinsic point defects rather than extensive collision cascades. Low flux electron irradiation leads to the formation of point defect complexes such as divacancies and dopant/intrinsic point defect pairs. High fluxes of MeV * Permanent address: LCMM, Departament de Fisica Aplicada i Electrbnica, Universitat de Barcelona, Diagonal 647, E-08028 Barcelona, Spain electrons create a supersaturation of self-interstitials which cluster in so-called {ll3}-defects which can be observed in situ during irradiation in a High-Voltage transmission Electron Microscope (HVEM). The distribution of {113}-defects in the irradiated sample can be used to monitor local variations of the intrinsic pointdefect concentration.Already in 1981, Brown and Fathy [1] observed a strong dependence of { 113}-defect generation on the type and the concentration of dopant atoms. Aseev and coworkers [2][3][4][5] have studied this phenomenon in more detail using silicon samples doped with different concentrations of boron or phosphorus atoms. Recently, experimental results were also obtained by the present authors by irradiating cross-section samples of wafers with a dopant concentration depth profile [6][7][8][9]. The impact of interfaces and localised mechanical stress fields on the {ll3}-defect distribution was discussed in a previous paper in which a first order model was presented to explain the generation of {ll3}-defects near TEM specimen surfaces and interfaces [10].Other extrinsic point defects which a...