The Morphology and Evolution of Cu&lt;sub&gt;6&lt;/sub&gt;Sn&lt;sub&gt;5&lt;/sub&gt; at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging

Wang, Yao Li; Zhang, Ke Ke; Li, Chen Yang; Han, Li

doi:10.4028/www.scientific.net/msf.704-705.685

Cited by 3 publications

(1 citation statement)

References 10 publications

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“…Brazing: After polishing and cleaning the surface to be welded and the filler metal sheet, one applies 1–2 drops of commercial CX600 water to wash the solder, places it into the brazing furnace, and obtains the solder joint after cooling. According to the literature [ 40 ], the brazing temperature for this test is 270 °C, and the sample is taken out for air cooling after 240 s of heat preservation.…”

Section: Experimental Materials and Methodsmentioning

confidence: 99%

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

Zhang

Gao

et al. 2023

Materials

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To solve the electromigration problem of micro−electronic connection solder joints, an ideal electromigration tester was designed, and the thickness of the intermetallic compounds (IMCs), average void diameter, grain orientation, failure, shear strength, and fracture path of Sn2.5Ag0.7Cu0.1RE0.05Ni−GNSs/Cu solder joints under constant−temperature electromigration were studied. The results indicate that the solder joints show evidence of typical electromigration polarity in the asymmetric growth of interfacial IMCs on the anode and cathode sides under the conditions of a current density ≥7 × 103 A/cm2 and an included angle between the c−axis of the β−Sn grains and the current direction θ ≤ 53.2°. The anode−side interfacial IMC is dominated by a Cu6Sn5 phase with a gradually increasing thickness, forming a Cu3Sn phase and showing evidence of microcracks. The Cu6Sn5 phase of the cathode−side interfacial IMC is gradually completely dissolved, and the growth of the Cu3Sn phase is accompanied by the formation of Kirkendall voids. The anisotropic diffusion of Cu atoms in the β−Sn of the micro−solder joints causes increased solder joint resistance and reduced shear strength. The shear fracture path of the solder joints moves from the cathode side near the IMC solder seam to the Cu3Sn interface. The shear fracture mechanism changes from ductile transgranular fracture dominated by β−Sn dimples to brittle fracture dominated by interfacial IMC cleavage and slip steps.

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Section: Experimental Materials and Methodsmentioning

confidence: 99%

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

Zhang

Gao

et al. 2023

Materials

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The Interfacial Intermetallic and Shear Strength of Ni Nanoparticle‐Decorated Reduced Graphene Oxide Reinforced Sn2.5Ag0.5Cu Lead‐Free Composite Soldering Joints

Huo

Zhang

et al. 2018

Adv Eng Mater

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The Ni nanoparticle‐decorated reduced graphene oxide (Ni‐rGO) reinforced Sn2.5Ag0.5Cu lead‐free composite solder, as well as the interfacial intermetallic (IMC) and the shear strength of soldering joints, are investigated with scanning electron microscopy (SEM), X‐ray diffraction (XRD), and transmission electron microscope (TEM). The results show that Ni‐rGO can be synthesized by the thermal decomposition method, and the adsorption type between Ni atoms and rGO is chemisorption. When the amount of Ni‐rGO addition reaches 0.05 wt%, the high strength and toughening Ni‐rGO reinforced lead‐free composite solder is obtained, with a tensile strength and elongation of 58.0 MPa and 32.3%, respectively. The growth of the interfacial IMC layers is restrained by the addition of Ni‐rGO, and the highly reliable soldering joints are obtained accordingly. When the amount of Ni‐rGO addition reaches 0.05 wt%, the shear strength of the Ni‐rGO reinforced lead‐free composite solder is 28.1 MPa, which is 26.6% higher than that of the plain Sn2.5Ag0.5Cu soldering joints. With the increase in the amount of Ni‐rGO, the fracture pattern is transforme from a ductile‐brittle mixed fracture to a ductile fracture. Additionally, the fracture pathway shifts from a transition zone, consisting of soldering seam and interfacial IMC, to the direction of the soldering seam.

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Influence of Ag content on the formation and growth of intermetallic compounds in Sn–Ag–Cu solder

Bai

Zan

Chen

et al. 2020

J Mater Sci: Mater Electron

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The Morphology and Evolution of Cu<sub>6</sub>Sn<sub>5</sub> at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging

Cited by 3 publications

References 10 publications

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

The Interfacial Intermetallic and Shear Strength of Ni Nanoparticle‐Decorated Reduced Graphene Oxide Reinforced Sn2.5Ag0.5Cu Lead‐Free Composite Soldering Joints

Influence of Ag content on the formation and growth of intermetallic compounds in Sn–Ag–Cu solder

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