The Role of U.V. Light in the Inhibition of Electroless Deposition

Chow, S. L.; Hedgecock, N. E.; Schlesinger, M.; Rezek, J.

doi:10.1149/1.2404384

Cited by 29 publications

(32 citation statements)

References 4 publications

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“…This was found (9) to be the case with the catalyst based on S n ( I I ) sensitizer. Attempts to investigate this by electron diffraction have so far been inconclusive.…”

Section: H a T For Ni A N D F U R T H E R M O R E T H A T T H E T mentioning

confidence: 85%

Tin (IV) Sensitizer for Photoselective Metal Deposition of Cobalt and Nickel from Alkaline Baths

Baylis

Hedgecock

Schlesinger

1977

J. Electrochem. Soc.

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Sn(IV) sensitizer can be used to achieve electroless plating in either basic Ni or Co metallizing baths, but only if an additional reducing bath is used between the activation step and the last rinse. Irradiation with ultraviolet light before this reduction step prevents subsequent plating for both Ni and Co. When irradiation follows reduction it inhi0its Ni plating. The effects of different reducing agents on the subsequent plating from acidic Ni, basic Ni, Co, and Cu baths are reported. Possible mechanisms for ultraviolet inhibition oi metal plating are discussed.In a previous publication (1) we showed that an aged Sn(IV) chloride solution can serve as a sensitizer for electroless copper plating and for nickel plating from an acidic bath. Ultraviolet irradiation of the substrate after Sn(IV) sensitization and Pd(II) activation was shown to have a marked effect on subsequent metal plating. In a copper bath, plating occurred only on the irradiated surface, producing a clear, sharp negative image, which we call a "stimulated" negative [see Ref. (2)]. In an acidic nickel bath, plating occurred only on the nonirradiated surface, producing a clear, sharp positive image of the photomask.In the light of these results, the performance of this sensitizing system with other metal plating baths was studied. This paper describes results obtained using alkaline nickel (3) and cobalt (3, 4) baths, both using hypophosphite as reducing agent.

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“…This was found (9) to be the case with the catalyst based on S n ( I I ) sensitizer. Attempts to investigate this by electron diffraction have so far been inconclusive.…”

Section: H a T For Ni A N D F U R T H E R M O R E T H A T T H E T mentioning

confidence: 85%

Tin (IV) Sensitizer for Photoselective Metal Deposition of Cobalt and Nickel from Alkaline Baths

Baylis

Hedgecock

Schlesinger

1977

J. Electrochem. Soc.

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“…Its common procedure is: first the surface of the polymer is "sensitized" by attachment of Sn2+ nuclei, and then "activated" by further replacement of Pd2+ nuclei. [9][10][11][12] The final electroless plating is carried Sn 2 l sensitize out in a plating bath under the strict control of composition, pH and temperature. In this article, to prepare the conductive particles used in anisotropic conductive adhesive, electroless nickel plating on the polystyrene microspheres was studied.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Conductive Particles by Electroless Nickel Plating on Polystyrene Microsphere

Wang

et al. 2006

2006 7th International Conference on Electronic Packaging Technology

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Anisotropic conductive adhesive (ACA) is an advanced packaging material with lots of merits, but its manufacture is of high tech upon multiple branches of knowledge. In this letter, a step of preparing the conductive particles of ACA was investigated, that is, electroless nickel plating on polymer microshperes. The process of the coating formation consists of four steps: chemical etching, sensitization, activation, and electroless plating. 0.23 pim in thickness uniform and smooth Ni-P coating on 3.7 pim in diameter polystyrene microspheres was formed upon 25 min plating. The advantage of this plating process is to ensure an easy and accurate control on the thickness and the quality of the plating coat.

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“…light to generate patterns in the catalytic surface of dielectric substrates has been well studied in recent years (1)(2)(3)(4). light to generate patterns in the catalytic surface of dielectric substrates has been well studied in recent years (1)(2)(3)(4).…”

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confidence: 99%

“…The mechanism that has been proposed for the preparation of a catalytic layer by the conventional process is substrate ~ Sn(II) --> substrate.Sn(II) [1] substrate.Sn (II) -~-Pd (II) ~ substrate. Sn (IV) .Pd (O) [2] The palladium metal is then the catalyst for the meta]lizing bath.…”

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confidence: 99%

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Tin (IV) Chloride Solution as a Sensitizer in Photoselective Metal Deposition

Baylis

Busuttil

Hedgecock

et al. 1976

J. Electrochem. Soc.

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Experiments were conducted which show that Sn(IV) bound to a substrate is capable, in conjunction with Pd(II), of catalyzing Ni-P plating and that this effect can be inhibited by u.v. light. Some of the parameters affecting the quality of the plating and u.v. inhibition were determined. It was also found that in order for u.v. irradiation to inhibit Ni-P plating, the radiation must be applied after the Pd(lI) activation step. In the case of copper, however, plating occurs only on the irradiated area of the catalyst. A mixture of Sn(IV) and Pd(II) was also found to catalyze Ni-P plating. The behavior of the catalyst deposited by this mixture was quite similar to that of the catalyst present after Pd(II) activation following Sn(IV) sensitization in the stepwise procedure. * Electrochemical Society Active 1VIember. ExperimentalAll chemicals were supplied by Fisher or Canlab, A.C.S. reagent grade, and were used without further purification.) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.218.248.209 Downloaded on 2015-04-06 to IP Vol. I23, No. 3 ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.218.248.209 Downloaded on 2015-04-06 to IP ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.218.248.209 Downloaded on 2015-04-06 to IP

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The Role of U.V. Light in the Inhibition of Electroless Deposition

Cited by 29 publications

References 4 publications

Tin (IV) Sensitizer for Photoselective Metal Deposition of Cobalt and Nickel from Alkaline Baths

Tin (IV) Sensitizer for Photoselective Metal Deposition of Cobalt and Nickel from Alkaline Baths

Preparation of Conductive Particles by Electroless Nickel Plating on Polystyrene Microsphere

Tin (IV) Chloride Solution as a Sensitizer in Photoselective Metal Deposition

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