2012 Symposium on VLSI Technology (VLSIT) 2012
DOI: 10.1109/vlsit.2012.6242525
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The understanding of the trap induced variation in bulk tri-gate devices by a novel random trap profiling (RTP) technique

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Cited by 15 publications
(8 citation statements)
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“…Advanced poly-Si gate bulk planar and trigate CMOS devices, with SiON insulator, were fabricated [7]. The fin width 30nm or 75nm and with various fin heights, 10nm, 15nm, and 30nm, and gate length= 36nm.…”
Section: Device Preparationmentioning
confidence: 99%
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“…Advanced poly-Si gate bulk planar and trigate CMOS devices, with SiON insulator, were fabricated [7]. The fin width 30nm or 75nm and with various fin heights, 10nm, 15nm, and 30nm, and gate length= 36nm.…”
Section: Device Preparationmentioning
confidence: 99%
“…For a long time, the study of dopant effect on the RDF induced V th variation has been mostly studied by the simulations [3][4][5]; until more recently, an experimental approach becomes feasible [6][7]. profiling of the dopant can be made through the calculation of the local threshold voltage based on an accurate calculation of the channel barrier potential under a varying source-to-drain bias.…”
Section: Principle Of the Discrete Dopant Profilingmentioning
confidence: 99%
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“…The understanding of discrete dopant effect on the RDF induced V th variation has been almost studied by the simulations [3][4][5]. Not until 2011, the understanding of the RDF became possible by using an experimental discrete dopant profiling technique [6][7]. Also, with the increasing need on developing the FinFET technology with an attempt to overcome the scaling issue, lots of efforts have been paid on the development of such technology [8][9].…”
Section: Introductionmentioning
confidence: 99%
“…According to the literature, oxide traps are considered to be the central physical factor responsible for several effects detrimental to the operating characteristics and reliability of metal-oxide-semiconductor transistors. Figure 1-2 presents the typical reliability and fluctuation problems that occurred in miniaturized devices, such as random telegraph noise (RTN) [28], [29], random trap fluctuation (RTF) [30], bias-temperature instability (BTI), and BTI-induced variability [31][32][33], all of which are associated with complex dynamic capture/emission characteristics within gate-oxide traps. The undesirable changes in transistor characteristics posed by these aging mechanisms are of prime practical interest for precise reliability assessment of realistic circuit usage.…”
Section: Reliability Challenges In Nanoscale Mos Devicesmentioning
confidence: 99%