Thermal analysis of high power LED packages under the alternating current operation

Shin, Moo Whan; Jang, Sun Ho

doi:10.1016/j.sse.2011.10.033

Cited by 40 publications

(22 citation statements)

References 7 publications

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“…R th represents the thermal resistance, T j represents junction temperature, T a represents ambient temperature, P represents the input power [14]. Two types of analysis, thermal and stress analysis were used to perform the simulation.…”

Section: Methodsmentioning

confidence: 99%

High Power LED Thermal and Stress Simulation on Copper Slug

Vairavan

Sauli

Retnasamy

et al. 2013

2013 UKSim 15th International Conference on Computer Modelling and Simulation

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High power LED are captivating attention due to its cogent impacts on lighting industry in terms of efficacy, low power consumption, long lifetime and miniature physical size. Nonetheless, the efficiency and reliability of the LED is signified by the junction temperature. This work demonstrates the thermal and stress simulation of single chip LED package with 1mm x1mm x 1mm copper heat slug. The simulation was performed using Ansys version 11. The GaN LED chip was powered with input power of 0.1 W and 1 W. The simulation outcome exhibited that at the maximum junction temperature and stress of the LED chip were 115.81°C and 221.56MPa correspondingly for input power of 1W.

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Section: Methodsmentioning

confidence: 99%

High Power LED Thermal and Stress Simulation on Copper Slug

Vairavan

Sauli

Retnasamy

et al. 2013

2013 UKSim 15th International Conference on Computer Modelling and Simulation

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show abstract

“…The LED junction thermal resistance is defined as (3) where R th symbolizes the thermal resistance, T j symbolizes junction temperature, T a symbolizes ambient temperature, P symbolizes the input power [13]. To perform the thermal and stress analysis, a 3D LED model was developed with the following layers and dimension.…”

Section: Methodsmentioning

confidence: 99%

5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED

Vairavan

Sauli

Retnasamy

et al. 2013

2013 7th Asia Modelling Symposium

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Light-emitting diodes (LEDs), have materialized as an innovative light source which features energy saving properties, good optical performance and efficacy which is added advantage over orthodox lighting systems. However, the efficacy of the LED is influenced by heat generated at the junction of the LED. Hence, in this study, the thermal and stress analysis of single chip LED package with copper diamond heat slug with dimension of 5mm x 5mm x 1mm was carried out through simulation under natural convection condition. Input power of 0.1W and 1W were applied to the single chip LED model. Result of the simulation indicates that at input power 1W, junction temperature of 107.02 °C and stress of 104.59 MPa were obtained.

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“…Where R th is the thermal resistance, T j the junction temperature, T a the ambient temperature, P is the input power [13].Simulation was executed using Ansys version 11.Before proceeding to simulation, assumptions were made to simplify the simulation process. They are stated in the following order.…”

Section: Methodsmentioning

confidence: 99%

Large Sized Slug on Solid State Lighting Stress and Temperature Analysis

Sauli¹,

Retnasamy²,

Vairavan³

et al. 2013

2013 8th EUROSIM Congress on Modelling and Simulation

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High brightness light emitting diodes, LEDs are the latest generation of solid-state lighting devices. These LEDs portray good luminous efficiency and energy saving properties when compared with the conventional lights. Despite the advantages of the LEDs, it is important to dissipate the heat generated by the PN junction of the LED to enviroment as trapped heat in the LED package will degrade the optical performance and life time of the LED. Hence, junction temperature of the LED is an important element which influences the reliability of the LED. The thermal and stress simulation of single chip LED package with 5mm x 5mm x 1mm copper heat slug is presented in this study. Ansys version 11 was utilized for simulation. Input power of 0.1W and 1W was applied to the LED chip. The simulated results exhibited for an input power of 1W, the max junction temperature is 108.71 °C and the stress is 212.41MPa.

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Thermal analysis of high power LED packages under the alternating current operation

Cited by 40 publications

References 7 publications

High Power LED Thermal and Stress Simulation on Copper Slug

High Power LED Thermal and Stress Simulation on Copper Slug

5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED

Large Sized Slug on Solid State Lighting Stress and Temperature Analysis

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