Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices

Abstract

Heat generation is a major issue in all electronics, as heat reduces product life, reliability, and performance, especially in flexible electronics with low thermal-conductivity polymeric substrates. In this sense, the active heat dissipation design with flow channels holds great promise. Here, a theoretical model, validated by finite element analysis and experiments, based on the method of the separation of variables, is developed to study the thermal behavior of the active heat dissipation design with an embedded flow channel. The influences of temperature and flow velocity of the fluid on heat dissipation performance were systematically investigated. The influence of channel spacing on heat dissipation performance was also studied by finite element analysis. The study shows that performance can be improved by decreasing the fluid temperature or increasing the flow velocity and channel density. These results can help guide the design of active heat dissipation with embedded flow channels to reduce adverse effects due to excessive heating, thus enhancing the performance and longevity of electronic products.

A microfluidics vapor-membrane-valve generated by laser irradiation on carbon nanocoils

“…A hypothesis could, thus, be that the increased expansion rate of bubble with an increasing flow rate is owing to the fluid flows accelerating the heat dissipation inside bubble. 36,37…”

“…A hypothesis could, thus, be that the increased expansion rate of bubble with an increasing ow rate is owing to the uid ows accelerating the heat dissipation inside bubble. 36,37 The uid ow rate in microchannel does not prevent the generation of microbubbles, but help the formation of the MVMV for clogging the channels. The higher the uid ow rate is, the shorter the formation time of the MVMV.…”

Icepak-based heat sink optimization design for automotive domain controllers

“…The famous 10 °C rule [2] shows that the thermal failure rate of certain electronic components more than doubles for every 10 °C increase in external temperature. Therefore, domain controllers as closed electronic devices need reliable thermal structures to guarantee the heat dissipation needs of internal heat sources [3] . In order to improve the heat transfer efficiency of the heat sink, domestic and foreign scholars have conducted heat dissipation optimization studies on the heat transfer efficiency of heat sink fins [4] , fin geometry parameters [5] , heat sink surface coating materials [6] [7] , and PCB(Printed Circuit Board) temperature distribution [8] .…”