2017
DOI: 10.1002/app.45332
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Thermal and mechanical properties of polyamide 12/graphene nanoplatelets nanocomposites and parts fabricated by fused deposition modeling

Abstract: The printable polyamide 12 (PA12) nanocomposite filaments with 6 wt % graphene nanoplatelets (GNPs) for fused deposition modeling (FDM) were prepared by melting compounding and smoothly printed via a commercial FDM three-dimensional (3D) printer. The thermal conductivity (k) and elastic modulus (E) of 3D printed PA12/GNPs parts along to the printing direction had an increase by 51.4% and 7% than that of compression molded parts, which is due to the GNPs preferentially aligning along to the printing direction. … Show more

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Cited by 136 publications
(99 citation statements)
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“…Vaezi and Yang investigated the mechanical properties of PEEK for medical applications and obtained the maximum tensile strength at 75 MPa. Zhu et al examined the thermal and mechanical properties of PA12/GNPs composite; the maximum tensile strength and modulus for pure PA12, which was printed in the zero direction, were 43.8 MPa and 1.495 GPa, respectively. Tanikella et al investigated the tensile strength of commercially available polymer materials; the maximum tensile strengths for PC, ABS, and high impact polystyrene were 49.08, 28.75, and 21.41 MPa, respectively.…”
Section: Introductionmentioning
confidence: 99%
“…Vaezi and Yang investigated the mechanical properties of PEEK for medical applications and obtained the maximum tensile strength at 75 MPa. Zhu et al examined the thermal and mechanical properties of PA12/GNPs composite; the maximum tensile strength and modulus for pure PA12, which was printed in the zero direction, were 43.8 MPa and 1.495 GPa, respectively. Tanikella et al investigated the tensile strength of commercially available polymer materials; the maximum tensile strengths for PC, ABS, and high impact polystyrene were 49.08, 28.75, and 21.41 MPa, respectively.…”
Section: Introductionmentioning
confidence: 99%
“…Polyamides (PAs), commonly called nylon, have been used extensively as films to package foods, drugs, daily chemicals, and transported goods in the packaging industry because of their high properties, including a favorable puncture resistance and excellent oxygen‐barrier and satisfactory cold‐ and heat‐resistance qualities . Polyamide 6–66 (PA6‐66) is one of the most widely used PA copolymers in the packaging industry.…”
Section: Introductionmentioning
confidence: 99%
“…PLA‐based nanocomposites with TA‐functionalized GNPs were first prepared (Figure ), and the uniform dispersion of GNPs in the nanocomposites and enhanced mechanical properties and thermal conductivity were observed. These nanocomposites are expected to have many potential applications in the areas of heat dissipation in LEDs and three‐dimensional printing materials for fused deposition modeling …”
Section: Introductionmentioning
confidence: 99%