Thermal Management Study of LTCC PIN Photodiode Module

Abstract

Multilayer low temperature co-fired ceramic (LTCC) is well known in usage as interconnect substrate, especially in high frequency application due to high electrical conductivity of the conductors and low loss of the LTCC dielectric. As substrate and packaging materials, there are many chips or devices placed on the multilayer LTCC board. In this paper, multilayer LTCC is implemented as the packaging at PIN photodiode (PD) module of the Radio over Fiber (RoF) system with the reason to increase thermal dissipation capacity of the PD module.

International Journal of Electronics and Telecommunications

“…As mentioned earlier, embedded cavities can be used for liquid cooling. A more preferred method is to utilize thermal vias under the high-dissipative dies [16]. This is a natural way to realize thermal management structures since vias are needed anyway for electrical functions.…”