Thermal Phenomena in Fiber-reinforced Thermoplastic Tape Winding Process: Computational Simulations and Experimental Validations

Abstract

This paper presents experimentally validated three-dimensional transient simulations of the thermal phenomena of the tape winding process, as well as a method to determine separately the heat transfer between the hot gas originating from a torch and the composite material. The computational model predicts the temperature of the incoming tape and the substrate during the winding process. Each numerical simulation is based on an explicit time integration scheme and covers the duration of the process. The simulation within each time step employs a steady-state model. This method takes into account the cyclic nonuniform heating of the material and the effect of the growing mass. The comparison of the simulation results with the experimental data shows good agreements. The experiments were performed with preconsolidated glass fiber-reinforced polypropylene tapes. The measurements were performed with infrared pyrometry. This technique can handle moving points during the entire process, and is nonintrusive.

A review of radiative heating in automated layup and its modelling

“…In filament winding thermoplastic prepreg tapes can be used under the same conditions as previously described [7,11], as well as in-situ curing of thermoset prepreg [32]. Therefore it is also considered in this review, reflecting studies and machinery covering both filament winding and automated layup, as classification can be difficult, especially for thermoplastic processing where a compaction roller is always required [11,28,31,53]. In fact, the first applications of laser heating technology were performed with thermoplastic filament winding, where it was selected for its highly focused energy input over infrared radiators [7,54,55].…”

Identification of non uniform thermal contact resistance in automated tape placement process

“…The flux boundary conditions with the mould, the roller and the air are modeled as the heat transfers at the interface between two plies but with fixed temperatures for those external elements. The values of all transfer coefficients are taken from the literature [12][13][14] while details of the boundary conditions are reported in Fig. 3.…”

Through-thickness compression response of uncured prepreg during manufacture by automated layup

“…Higher porosity in the uncured part is also commonplace due to the regular omission of vacuum consolidation and void removal during layup; void removal during layup may be ineffective for most large structures commonly made using automated layup [8,9]. Most research work in the past was aimed at addressing issues during thermoplastic tape laying, see, for example, Ranganathan et al [10], Pitchumani et al [11], and Toso and Ermanni [12]. Also, Sarrazin and Springer [13] derived a process model for thermoset layup from existing thermoplastic models, but this area in general has received little attention.…”