Proceedings Electronic Components and Technology, 2005. ECTC '05.
DOI: 10.1109/ectc.2005.1441396
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Thermal simulation for predicting substrate temperature during reflow soldering process

Abstract: Widespread use of lead-free solders requires precise control of the temperature on a substrate during reflow soldering, because the margin between the higher melting temperatures of lead-free solders and the heat-resistant temperatures of electronic components becomes narrow. For this purpose, the thermal simulation method has been developed for predicting the temperature on a substrate and optimizing the temperature profile during the reflow soldering process. Most reflow furnaces have two heating systems: fo… Show more

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Cited by 22 publications
(15 citation statements)
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“…Although, a method for optimizing the heating capability of forced convection reflow ovens was published in [11], but it was based on a wrong correlation between a and the heater temperature. Several newer thermal models of the reflow soldering process [12,13] still use an average or some different values of a for the whole oven, but this is a wrong approach. The value of a highly depends on the location in each heater zones.…”
Section: Introductionmentioning
confidence: 96%
“…Although, a method for optimizing the heating capability of forced convection reflow ovens was published in [11], but it was based on a wrong correlation between a and the heater temperature. Several newer thermal models of the reflow soldering process [12,13] still use an average or some different values of a for the whole oven, but this is a wrong approach. The value of a highly depends on the location in each heater zones.…”
Section: Introductionmentioning
confidence: 96%
“…A method for optimizing the heating capability of heater gas streams in convection reflow ovens was carried out by the geometry and dimension modifications of the nozzles [13]. Inoue [14] has approximated the heat transfer coefficient of the heater gas streams from the nozzle-matrix blower system with the systematic series of experiments. The direction characteristics of the heat transfer coefficient were also studied by temperature measurements [10,15].…”
Section: Introductionmentioning
confidence: 99%
“…An approximation of the  parameter in convection reflow ovens (with nozzle-matrix blower system) already exists [22]:…”
Section: Introductionmentioning
confidence: 99%